Abstract: Illustrative embodiments provide an electrostatic actuator and methods of making and operating an electrostatic actuator. The electrostatic actuator comprises a framework and a plurality of electrodes. The framework comprises walls defining a plurality of cells forming an array of cells. The plurality of electrodes comprise an electrode in each cell in the plurality of cells. A gap separates the electrode in each cell from the walls of the cell. The framework is configured to contract in response to an electrical signal applied between the framework and the plurality of electrodes.

Abstract: Illustrative embodiments provide an electrostatic actuator and methods of making and operating an electrostatic actuator. The electrostatic actuator comprises a framework and a plurality of electrodes. The framework comprises walls defining a plurality of cells forming an array of cells. The plurality of electrodes comprise an electrode in each cell in the plurality of cells. A gap separates the electrode in each cell from the walls of the cell. The framework is configured to contract in response to an electrical signal applied between the framework and the plurality of electrodes.

Abstract: Embodiments of the invention include aerosol impactors comprising one or more micromechanical resonators. Impactors according to embodiments of the invention can provide size classification and/or concentration of aerosol particulate. Aerosol impactors can use an air flow device, such as a pump, to create a constant flow of air. Nozzles of varying diameters are used to separate particulate of varying sizes and the particles that pass through strike a measuring device. MEMS resonators can be integrated into arrays to provide mass sensitivity in a small, lightweight and cost effective package, which will effectively allow for the measurement of the mass of every micro/nanoscale particle landing on the surface.

Abstract: Embodiments of the invention include micromechanical resonators. These resonators can be fabricated from thin silicon layers. Both rotational and translational resonators are disclosed. Translational resonators can include two plates coupled by two resonate beams. A stable DC bias current can be applied across the two beams that causes the plates to resonate. In other embodiments, disk resonators can be used in a rotational mode. Other embodiments of the invention include using resonators as timing references, frequency sources, particle mass sensors, etc.

Abstract: Embodiments of the invention include aerosol impactors comprising one or more micromechanical resonators. Impactors according to embodiments of the invention can provide size classification and/or concentration of aerosol particulate. Aerosol impactors can use an air flow device, such as a pump, to create a constant flow of air. Nozzles of varying diameters are used to separate particulate of varying sizes and the particles that pass through strike a measuring device. MEMS resonators can be integrated into arrays to provide mass sensitivity in a small, lightweight and cost effective package, which will effectively allow for the measurement of the mass of every micro/nanoscale particle landing on the surface.

Abstract: Embodiments of the invention include micromechanical resonators. These resonators can be fabricated from thin silicon layers. Both rotational and translational resonators are disclosed. Translational resonators can include two plates coupled by two resonate beams. A stable DC bias current can be applied across the two beams that causes the plates to resonate. In other embodiments, disk resonators can be used in a rotational mode. Other embodiments of the invention include using resonators as timing references, frequency sources, particle mass sensors, etc.

Abstract: Disclosed are capacitive micromechanical resonators optimized for high Q, low motional impedance, and large tuning range. Exemplary resonators were fabricated using a HARPSS-on-SOI process, and demonstrated quality factors up to 119000 in vacuum. For resonators operating between 3 MHz and 30 MHz, the lowest extracted impedance is 218 k? and the largest electrostatic tuning coefficient is ?240 ppm/V2. The disclosed designs are applicable up to at least 200 MHz operation. An oscillator interface circuit comprising of a trans-impedance amplifier and an automatic bias generator providing a temperature-compensating bias voltage is also disclosed. Experiments show temperature drift reduction from 2800 ppm to 39 ppm over a 100° C. range. Process compensation (DFM) of micromechanical resonators, resonators having mass loading elements that allow generation of closely spaced frequencies, and coupled systems comprising of the resonators are also described.

Abstract: Disclosed are high frequency, vertical silicon bulk acoustic resonators. Resonator structures having a relatively large transduction areas fabricated using a HARPSS fabrication process provide for high frequency capacitive resonators with significantly low impedance values. Impedance values as low as a few kilo-Ohms to sub-kilo-Ohm and quality factors in the range of 20,000 to 90,000 in the VHF range have been achieved for a first thickness mode of fabricated vertical silicon bulk acoustic resonators. Resonant frequencies as high as 983 MHz have been demonstrated for higher third thickness modes of the vertical silicon bulk acoustic resonators.

Abstract: An electrically-coupled micro-electro-mechanical system (MEMS) filter system and method are disclosed. In one embodiment, the MEMS filter system comprises a first microelectromechanical system (MEMS) resonator comprising a first resonating element, a second MEMS resonator comprising a second resonating element, the sescond resonating element closely spaced and mechanically separate from the first resonating element, wherein the first MEMS resonator is coupled to the second MEMS resonator through the electrostatic force acting between resonating portions of the MEMS resonators, and additional MEMS resonators electrically coupled to the first MEMS resonator, the second MEMS resonator, or the first and second MEMS resonators.

Abstract: Disclosed are capacitive micromechanical resonators optimized for high Q, low motional impedance, and large tuning range. Exemplary resonators were fabricated using a HARPSS-on-SOI process, and demonstrated quality factors up to 119000 in vacuum. For resonators operating between 3 MHz and 30 MHz, the lowest extracted impedance is 218 k? and the largest electrostatic tuning coefficient is ?240 ppm/V2. The disclosed designs are applicable up to at least 200 MHz operation. An oscillator interface circuit comprising of a trans-impedance amplifier and an automatic bias generator providing a temperature-compensating bias voltage is also disclosed. Experiments show temperature drift reduction from 2800 ppm to 39 ppm over a 100° C. range. Process compensation (DFM) of micromechanical resonators, resonators having mass loading elements that allow generation of closely spaced frequencies, and coupled systems comprising of the resonators are also described.

Abstract: A micro-electro-mechanical system (MEMS) capacitive resonator and methods for manufacturing the same are invented and disclosed. In one embodiment, a method comprises forming trenches in a substrate, conformally coating the substrate with an oxide, filling the coated trenches with polysilicon, patterning the polysilicon, releasing a resonating structure derived from the substrate, and removing the conformally coated oxide.

Abstract: A micro-electro-mechanical system (MEMS) capacitive resonator and methods for manufacturing the same are invented and disclosed. In one embodiment, the MEMS capacitive resonator comprises a semiconductor resonating member and a polysilicon electrode capacitively coupled to the semiconductor resonating member.

Abstract: An electrically-coupled micro-electro-mechanical system (MEMS) filter system and method are disclosed. In one embodiment, the MEMS filter system comprises includes a first MEMS resonator, and a second MEMS resonator electrically coupled to the first MEMS resonator.