Patents by Inventor Siaw Teck Sang

Siaw Teck Sang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080131672
    Abstract: The subject of the invention is a metallized film produced using a multilayer structure comprising a tie layer comprising: 5 to 50% by weight of a blend (A) comprising: 5 to 100% of a cografted blend of polymers (C1) and (C2), consisting of 90 to 20% by weight of a metallocene polyethylene (C1) of density between 0.865 and 0.915 and of 10 to 80% by weight of a polymer (C2) which is either a non-metallocene LLDPE or a polypropylene homopolymer or copolymer, and 95 to 0% by weight of a polyethylene (D) chosen from polyethylene homopolymers or copolymers and elastomers; the blend (A) being such that: the content of grafting monomer grafted is between 30 and 105 ppm; the MFI or meltflow index (ASTM D 1238, at 190° C./2.16 kg) is between 0.1 and 30 g/10 min; 50 to 95% by weight of a polypropylene homopolymer or copolymer (B).
    Type: Application
    Filed: February 9, 2004
    Publication date: June 5, 2008
    Inventors: Siaw Teck Sang, Yves Ledu, Patrice Robert