Patents by Inventor Siaw-Yun Chin

Siaw-Yun Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100282733
    Abstract: A thermal processing apparatus includes a chamber for accommodating a semiconductor wafer and a radiant fitting. The radiant fitting includes a plurality of first radiant sources having a first reflectivity positioned in a center region of the radiant fitting and a plurality of second radiant sources having a second reflectivity. The second reflectivity is larger than the first reflectivity.
    Type: Application
    Filed: May 5, 2009
    Publication date: November 11, 2010
    Inventor: Siaw-Yun Chin