Patents by Inventor Sicong Wang
Sicong Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12584764Abstract: Implementations are directed to assigning corresponding semantic identifiers to a plurality of rows of an agricultural field, generating a local mapping of the agricultural field that includes the plurality of rows of the agricultural field, and subsequently utilizing the local mapping in performance of one or more agricultural operations. In some implementations, the local mapping can be generated based on overhead vision data that captures at least a portion of the agricultural field. In these implementations, the local mapping can be generated based on GPS data associated with the portion of the agricultural field captured in the overhead vision data. In other implementations, the local mapping can be generated based on driving data generated during an episode of locomotion of a vehicle through the agricultural field. In these implementations, the local mapping can be generated based on GPS data associated with the vehicle traversing through the agricultural field.Type: GrantFiled: May 18, 2023Date of Patent: March 24, 2026Assignee: Deere & CompanyInventors: Alan Eneev, Jie Yang, Yueqi Li, Yujing Qian, Nanzhu Wang, Sicong Wang, Sergey Yaroshenko
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Patent number: 12460920Abstract: Systems and methods for measuring a surface topography of a semiconductor chip are disclosed. A disclosed system comprises a light source configured to provide low coherent light to a first beam splitter, a scanner configured to use the low coherent light reflected from the first beam splitter to scan positions on a surface of a semiconductor chip, a second beam splitter configured to receive reflected signals from the positions on the surface of the semiconductor chip, a detector configured to detect interference signals from a first output of the second beam splitter, wherein each of the interference signals corresponds to a respective one of the positions, and a spectrometer configured to detect spectrum signals from a second output of the second beam splitter, wherein each of the spectrum signals corresponds to the respective one of the positions.Type: GrantFiled: December 14, 2022Date of Patent: November 4, 2025Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Sicong Wang, Xiaoye Ding
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Publication number: 20240270854Abstract: A BMP2 surrogate protein is provided comprising two different antigen binding regions (ABR), which can be configured as immunoglobulin “single variable domains” (ISV). A first ISV specifically binds to a first BMP2 receptor, e.g. BMPR1a; and a second ISV specifically binds to a second BMP2 receptor, e.g. BMPR2. In some embodiments the first and second ISV are joined by a cleavable linker that is susceptible to proteases selectively expressed in monocytic cells or macrophages, relative to skeletal stem cells.Type: ApplicationFiled: May 24, 2022Publication date: August 15, 2024Inventors: Charles K.F. Chan, Liming Zhao, Sicong Wang, Michael T. Longaker, Eri Takematsu
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Patent number: 11796307Abstract: Embodiments of systems and methods for measuring a surface topography of a semiconductor structure are disclosed. In certain examples, a plurality of interference signals, each corresponding to a respective one of a plurality of positions on a surface of the semiconductor structure, are measured. Calibration signals, associated with a baseline region corresponding to a first category of a plurality of categories and a calibrated region corresponding to a second category of the plurality of categories, are measured. A surface height offset, associated with the baseline region and the calibrated region, is determined based on original surface heights and the calibration signals. The original surface heights are determined based on the plurality of interference signals corresponding to the baseline region and the calibrated region. The surface topography of the semiconductor structure is characterized based, at least in part, on the surface height offset and the original surface heights.Type: GrantFiled: November 2, 2021Date of Patent: October 24, 2023Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Sicong Wang, Xiaoye Ding, Yi Zhou
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Patent number: 11790943Abstract: A dual-pulse excitation method for ultra-fast, super-resolution all-optical magnetic recording includes the steps of: providing a first excitation pulse and a second modulation pulse; and focusing the first excitation pulse and the second modulation pulse, and then radiating the two pulses in sequence to a magneto-optical recording medium, so that an area of the magneto-optical recording medium irradiated undergoes opto-magnetic reversal. By controlling the time delay, spatial overlapping area, and energy density ratio between the dual femtosecond laser pulses, it can induce a second reversal of the magnetization field in the spatial overlapping area of the two pulses on the magneto-optical material that can achieve single-pulse opto-magnetic reversal to obtain all-optical magnetic recording beyond the diffraction limit. This process takes place within several hundred picoseconds, thus providing an effective technical means for ultra-high density and ultra-fast magnetic storage.Type: GrantFiled: November 16, 2020Date of Patent: October 17, 2023Assignee: Jinan UniversityInventors: Sicong Wang, Chen Wei, Xiangping Li
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Publication number: 20230288225Abstract: Implementations are directed to assigning corresponding semantic identifiers to a plurality of rows of an agricultural field, generating a local mapping of the agricultural field that includes the plurality of rows of the agricultural field, and subsequently utilizing the local mapping in performance of one or more agricultural operations. In some implementations, the local mapping can be generated based on overhead vision data that captures at least a portion of the agricultural field. In these implementations, the local mapping can be generated based on GPS data associated with the portion of the agricultural field captured in the overhead vision data. In other implementations, the local mapping can be generated based on driving data generated during an episode of locomotion of a vehicle through the agricultural field. In these implementations, the local mapping can be generated based on GPS data associated with the vehicle traversing through the agricultural field.Type: ApplicationFiled: May 18, 2023Publication date: September 14, 2023Inventors: Alan Eneev, Jie Yang, Yueqi Li, Yujing Qian, Nanzhu Wang, Sicong Wang, Sergey Yaroshenko
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Patent number: 11703351Abstract: Implementations are directed to assigning corresponding semantic identifiers to a plurality of rows of an agricultural field, generating a local mapping of the agricultural field that includes the plurality of rows of the agricultural field, and subsequently utilizing the local mapping in performance of one or more agricultural operations. In some implementations, the local mapping can be generated based on overhead vision data that captures at least a portion of the agricultural field. In these implementations, the local mapping can be generated based on GPS data associated with the portion of the agricultural field captured in the overhead vision data. In other implementations, the local mapping can be generated based on driving data generated during an episode of locomotion of a vehicle through the agricultural field. In these implementations, the local mapping can be generated based on GPS data associated with the vehicle traversing through the agricultural field.Type: GrantFiled: December 22, 2020Date of Patent: July 18, 2023Assignee: MINERAL EARTH SCIENCES LLCInventors: Alan Eneev, Jie Yang, Yueqi Li, Yujing Qian, Nanzhu Wang, Sicong Wang, Sergey Yaroshenko
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Publication number: 20230144331Abstract: Systems and methods for measuring a surface topography of a semiconductor chip are disclosed. A disclosed system comprises a light source configured to provide low coherent light to a first beam splitter, a scanner configured to use the low coherent light reflected from the first beam splitter to scan positions on a surface of a semiconductor chip, a second beam splitter configured to receive reflected signals from the positions on the surface of the semiconductor chip, a detector configured to detect interference signals from a first output of the second beam splitter, wherein each of the interference signals corresponds to a respective one of the positions, and a spectrometer configured to detect spectrum signals from a second output of the second beam splitter, wherein each of the spectrum signals corresponds to the respective one of the positions.Type: ApplicationFiled: December 14, 2022Publication date: May 11, 2023Inventors: Sicong Wang, Xiaoye Ding
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Patent number: 11562919Abstract: Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals and a plurality of spectrum signals are received by at least one processor. Each of the interference signals and spectrum signals corresponds to a respective one of a plurality of positions on a surface of the semiconductor chip. The spectrum signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories.Type: GrantFiled: June 24, 2020Date of Patent: January 24, 2023Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Sicong Wang, Xiaoye Ding
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Publication number: 20220310121Abstract: A dual-pulse excitation method for ultra-fast, super-resolution all-optical magnetic recording includes the steps of: providing a first excitation pulse and a second modulation pulse; and focusing the first excitation pulse and the second modulation pulse, and then radiating the two pulses in sequence to a magneto-optical recording medium, so that an area of the magneto-optical recording medium irradiated undergoes opto-magnetic reversal. By controlling the time delay, spatial overlapping area, and energy density ratio between the dual femtosecond laser pulses, it can induce a second reversal of the magnetization field in the spatial overlapping area of the two pulses on the magneto-optical material that can achieve single-pulse opto-magnetic reversal to obtain all-optical magnetic recording beyond the diffraction limit. This process takes place within several hundred picoseconds, thus providing an effective technical means for ultra-high density and ultra-fast magnetic storage.Type: ApplicationFiled: November 16, 2020Publication date: September 29, 2022Inventors: Sicong Wang, Chen Wei, Xiangping Li
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Patent number: 11454491Abstract: Embodiments of systems for classifying interference signals are disclosed. In an example, a system for classifying interference signals includes an interferometer including a light source and a detector, and at least one processor. The interferometer is configured to provide a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of a semiconductor chip. A spectrum of the light source is greater than a spectrum of white light. The at least one processor is configured to classify the interference signals into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip.Type: GrantFiled: June 24, 2020Date of Patent: September 27, 2022Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Sicong Wang, Xiaoye Ding
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Patent number: 11448499Abstract: Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of the semiconductor chip are received by at least one processor. The interference signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories.Type: GrantFiled: June 24, 2020Date of Patent: September 20, 2022Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Sicong Wang, Xiaoye Ding
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Publication number: 20220196433Abstract: Implementations are directed to assigning corresponding semantic identifiers to a plurality of rows of an agricultural field, generating a local mapping of the agricultural field that includes the plurality of rows of the agricultural field, and subsequently utilizing the local mapping in performance of one or more agricultural operations. In some implementations, the local mapping can be generated based on overhead vision data that captures at least a portion of the agricultural field. In these implementations, the local mapping can be generated based on GPS data associated with the portion of the agricultural field captured in the overhead vision data. In other implementations, the local mapping can be generated based on driving data generated during an episode of locomotion of a vehicle through the agricultural field. In these implementations, the local mapping can be generated based on GPS data associated with the vehicle traversing through the agricultural field.Type: ApplicationFiled: December 22, 2020Publication date: June 23, 2022Inventors: Alan Eneev, Jie Yang, Yueqi Li, Yujing Qian, Nanzhu Wang, Sicong Wang, Sergey Yaroshenko
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Publication number: 20220057191Abstract: Embodiments of systems and methods for measuring a surface topography of a semiconductor structure are disclosed. In certain examples, a plurality of interference signals, each corresponding to a respective one of a plurality of positions on a surface of the semiconductor structure, are measured. Calibration signals, associated with a baseline region corresponding to a first category of a plurality of categories and a calibrated region corresponding to a second category of the plurality of categories, are measured. A surface height offset, associated with the baseline region and the calibrated region, is determined based on original surface heights and the calibration signals. The original surface heights are determined based on the plurality of interference signals corresponding to the baseline region and the calibrated region. The surface topography of the semiconductor structure is characterized based, at least in part, on the surface height offset and the original surface heights.Type: ApplicationFiled: November 2, 2021Publication date: February 24, 2022Inventors: Sicong Wang, Xiaoye Ding, Yi Zhou
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Patent number: 11243067Abstract: Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of the semiconductor chip are received by at least one processor. The plurality of interference signals are transformed by the at least one processor into a plurality of spectrum signals each corresponding to the respective one of the positions on the surface of the semiconductor chip. The spectrum signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip.Type: GrantFiled: June 24, 2020Date of Patent: February 8, 2022Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.Inventors: Sicong Wang, Xiaoye Ding, Yi Zhou
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Publication number: 20210265185Abstract: Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals and a plurality of spectrum signals are received by at least one processor. Each of the interference signals and spectrum signals corresponds to a respective one of a plurality of positions on a surface of the semiconductor chip. The spectrum signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories.Type: ApplicationFiled: June 24, 2020Publication date: August 26, 2021Inventors: Sicong Wang, Xiaoye Ding
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Publication number: 20210262779Abstract: Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of the semiconductor chip are received by at least one processor. The plurality of interference signals are transformed by the at least one processor into a plurality of spectrum signals each corresponding to the respective one of the positions on the surface of the semiconductor chip. The spectrum signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip.Type: ApplicationFiled: June 24, 2020Publication date: August 26, 2021Inventors: Sicong Wang, Xiaoye Ding, Yi Zhou
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Publication number: 20210262785Abstract: Embodiments of systems and methods for measuring a surface topography of a semiconductor chip are disclosed. In an example, a method for measuring a surface topography of a semiconductor chip is disclosed. A plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of the semiconductor chip are received by at least one processor. The interference signals are classified by the at least one processor into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip. A surface height offset between a surface baseline and at least one of the categories is determined by the at least one processor based, at least in part, on a calibration signal associated with the region corresponding to the at least one of the categories.Type: ApplicationFiled: June 24, 2020Publication date: August 26, 2021Inventors: Sicong Wang, Xiaoye Ding
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Publication number: 20210262778Abstract: Embodiments of systems for classifying interference signals are disclosed. In an example, a system for classifying interference signals includes an interferometer including a light source and a detector, and at least one processor. The interferometer is configured to provide a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of a semiconductor chip. A spectrum of the light source is greater than a spectrum of white light. The at least one processor is configured to classify the interference signals into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip.Type: ApplicationFiled: June 24, 2020Publication date: August 26, 2021Inventors: Sicong Wang, Xiaoye Ding
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Publication number: 20190210156Abstract: The present invention discloses a work fixture, a device and a method for machining the cutting edge of cutting tools. The work fixture comprising: rotatable beveled base inside the fixture shell, the angle of the beveled base can be adjusted by the angle adjusting device; a feeding plate on the beveled base, on which a plurality of grooves are equispaced on the plate for clamping the cutting tools to be machined and completing the machining of the cutting edge. The device and the method of the present invention comprising: a controller being connected with a laser and a laser galvanometer, respectively; the beam of the laser sequentially passing through the reflection lens and the laser galvanometer to make the incident direction perpendicular to the datum plane and shot on the cutting tool to be machined on the feeding plate, and completing the machining of the cutting edge. Wherein, the laser parameters include a wavelength of 100 nm˜1064 nm, 10.Type: ApplicationFiled: November 18, 2016Publication date: July 11, 2019Inventors: Lingfei Ji, Wenhao Wang, Tianyang Yan, Rui Jiang, Sicong Wang, Zhenyuan Lin, Qiang Yang