Patents by Inventor Sid SRIVASTAVA

Sid SRIVASTAVA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140255681
    Abstract: An adhesive tape comprising a core layer comprising a foam and having a first surface and a second surface opposite the first surface. The adhesive tape also comprises a first adhesive layer disposed about the first surface. And, the adhesive tape also comprises a second adhesive layer disposed about the second surface. At least one of the first and second adhesive layers comprises a radiation curable rubber based adhesive. The tapes are suitable for bonding an article to a target substrate having a low surface energy and for bonding under a variety of atmospheric conditions including at elevated temperatures.
    Type: Application
    Filed: March 5, 2014
    Publication date: September 11, 2014
    Applicant: Avery Dennison Corporation
    Inventors: Thomas C. EPPLE, Chan U. KO, Robert MEDSKER, Sid SRIVASTAVA