Patents by Inventor Siddharth Arunkumar Agrawal

Siddharth Arunkumar Agrawal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10830641
    Abstract: Systems and methods which provide a compact spectrometer using static Fourier transform interferometer (SFTI) cube configurations, such as are suitable for use with respect to mobile and portable electronic devices, are described. A SFTI cube of embodiments comprises a monolithic dual mirrored wedge beam splitter structure wherein mirrored wedge surfaces provide two reflective mirrors that are slightly tilted away from the orthogonal directions so that the resultant beams of light cross over one another and form an interference pattern. SFTI cube implementations of embodiments facilitate highly compact spectrometer configurations having a wide wavelength range, high resolution, high throughput, and low cost.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: November 10, 2020
    Assignee: Hong Kong Applied Science and Technology Research Institute Co., Ltd.
    Inventors: Jiangquan Mai, Wai Yi Yeung, Siddharth Arunkumar Agrawal, Chun Zhang
  • Publication number: 20200025611
    Abstract: Systems and methods which provide a compact spectrometer using static Fourier transform interferometer (SFTI) cube configurations, such as are suitable for use with respect to mobile and portable electronic devices, are described. A SFTI cube of embodiments comprises a monolithic dual mirrored wedge beam splitter structure wherein mirrored wedge surfaces provide two reflective mirrors that are slightly tilted away from the orthogonal directions so that the resultant beams of light cross over one another and form an interference pattern. SFTI cube implementations of embodiments facilitate highly compact spectrometer configurations having a wide wavelength range, high resolution, high throughput, and low cost.
    Type: Application
    Filed: July 17, 2018
    Publication date: January 23, 2020
    Inventors: Jiangquan Mai, Wai Yi Yeung, Siddharth Arunkumar Agrawal, Chun Zhang