Patents by Inventor Siddharth P. Nagarkatti
Siddharth P. Nagarkatti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10424460Abstract: A plasma source includes a ring plasma chamber, a primary winding around an exterior of the ring plasma chamber, multiple ferrites, wherein the ring plasma chamber passes through each of the ferrites and multiple plasma chamber outlets coupling the plasma chamber to a process chamber. Each one of the plasma chamber outlets having a respective plasma restriction. A system and method for generating a plasma are also described.Type: GrantFiled: August 22, 2016Date of Patent: September 24, 2019Assignee: Lam Research CorporationInventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William R. Entley
-
Patent number: 10283325Abstract: A processing chamber including multiple plasma sources in a process chamber top. Each one of the plasma sources is a ring plasma source including a primary winding and multiple ferrites. A plasma processing system is also described. A method of plasma processing is also described.Type: GrantFiled: October 10, 2012Date of Patent: May 7, 2019Assignee: Lam Research CorporationInventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William R. Entley
-
Publication number: 20180228015Abstract: A chamber top for a processing chamber is provided. The chamber top includes a first plasma source oriented horizontally over the chamber top and a second plasma source oriented horizontally over the chamber top. The second plasma source is arranged concentrically around the first plasma source. Also included is a first plurality of ferrites encircling the first plasma source and a second plurality of ferrites encircling the second plasma source. A first primary winding is disposed around an outer circumference of the first plasma source and a second primary winding disposed around an outer circumference of the second plasma source. The first and second primary windings pass through the respective plurality of ferrites. A plurality of outlets is disposed on a lower portion of the first and second plasma sources, and the plurality of outlets is oriented between adjacent ones of the first and second plurality of ferrites.Type: ApplicationFiled: April 10, 2018Publication date: August 9, 2018Inventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William Entley
-
Patent number: 9967965Abstract: A processing chamber including multiple plasma sources in a process chamber top. Each one of the plasma sources is a ring plasma source including a primary winding and multiple ferrites. A plasma processing system is also described. A method of plasma processing is also described.Type: GrantFiled: September 26, 2012Date of Patent: May 8, 2018Assignee: Lam Research CorporationInventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William Entley
-
Publication number: 20160358754Abstract: A plasma source includes a ring plasma chamber, a primary winding around an exterior of the ring plasma chamber, multiple ferrites, wherein the ring plasma chamber passes through each of the ferrites and multiple plasma chamber outlets coupling the plasma chamber to a process chamber. Each one of the plasma chamber outlets having a respective plasma restriction. A system and method for generating a plasma are also described.Type: ApplicationFiled: August 22, 2016Publication date: December 8, 2016Inventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William R. Entley
-
Patent number: 9449793Abstract: A plasma source includes a ring plasma chamber, a primary winding around an exterior of the ring plasma chamber, multiple ferrites, wherein the ring plasma chamber passes through each of the ferrites and multiple plasma chamber outlets coupling the plasma chamber to a process chamber. Each one of the plasma chamber outlets having a respective plasma restriction. A system and method for generating a plasma are also described.Type: GrantFiled: August 6, 2010Date of Patent: September 20, 2016Assignee: Lam Research CorporationInventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William R. Entley
-
Patent number: 9155181Abstract: A plasma source includes a ring plasma chamber, a primary winding around an exterior of the ring plasma chamber and multiple ferrites, wherein the ring plasma chamber passes through each of the ferrites. A system and method for generating a plasma are also described.Type: GrantFiled: August 6, 2010Date of Patent: October 6, 2015Assignee: Lam Research CorporationInventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William R. Entley
-
Patent number: 8999104Abstract: A plasma source includes multiple ring plasma chambers, multiple primary windings, multiple ferrites and a control system. Each one of the primary windings is wrapped around an exterior one of the ring plasma chambers. Each one of the plurality of the ring plasma chamber passes through a respective portion of the plurality of ferrites. The control system is coupled to each of the ring plasma chambers. A system and method for generating and using a plasma are also described.Type: GrantFiled: August 6, 2010Date of Patent: April 7, 2015Assignee: Lam Research CorporationInventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William R. Entley
-
Patent number: 8710926Abstract: A system and method are provided for delivering power to a dynamic load. The system includes a power supply providing DC power having a substantially constant power open loop response, a power amplifier for converting the DC power to RF power, a sensor for measuring voltage, current and phase angle between voltage and current vectors associated with the RF power, an electrically controllable impedance matching system to modify the impedance of the power amplifier to at least a substantially matched impedance of a dynamic load, and a controller for controlling the electrically controllable impedance matching system. The system further includes a sensor calibration measuring module for determining power delivered by the power amplifier, an electronic matching system calibration module for determining power delivered to a dynamic load, and a power dissipation module for calculating power dissipated in the electrically controllable impedance matching system.Type: GrantFiled: February 8, 2012Date of Patent: April 29, 2014Assignee: MKS Instruments, Inc.Inventors: Siddharth P. Nagarkatti, Yevgeniy Barskiy, Feng Tian, Ilya Bystryak
-
Publication number: 20140096908Abstract: A processing chamber including multiple plasma sources in a process chamber top. Each one of the plasma sources is a ring plasma source including a primary winding and multiple ferrites. A plasma processing system is also described. A method of plasma processing is also described.Type: ApplicationFiled: October 10, 2012Publication date: April 10, 2014Applicant: LAM RESEARCH CORPORATIONInventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William R. Entley
-
Patent number: 8689822Abstract: A pressure control system remotely controls pressure within one or more remote zones, each respectively connected to an enclosure through a conduit, by controlling flow of a fluid into and out of each enclosure. The pressure of the fluid is measured within each enclosure. An estimated pressure within each zone is computed, as a function of the measured pressure in the enclosure and known characteristics of the conduit and the zone. For each zone, an inlet proportional valve and an outlet proportional valve of each enclosure is operated so as to control the input flow rate of the fluid into the respective enclosure and the output flow rate of the fluid out of the enclosure as a function of a pressure set point and the estimated pressure, thereby regulating pressure within the zone in accordance with the pressure set point.Type: GrantFiled: October 12, 2011Date of Patent: April 8, 2014Assignee: MKS Instruments, Inc.Inventors: Ali Shajii, Siddharth P. Nagarkatti, Gordon Hill
-
Patent number: 8692466Abstract: Described are methods and apparatuses, including computer program products, for igniting and/or sustaining a plasma in a reactive gas generator. Power is provided from an ignition power supply to a plasma ignition circuit. A pre-ignition signal of the plasma ignition circuit is measured. The power provided to the plasma ignition circuit is adjusted based on the measured pre-ignition signal and an adjustable pre-ignition control signal. The adjustable pre-ignition control signal is adjusted after a period of time has elapsed.Type: GrantFiled: February 27, 2009Date of Patent: April 8, 2014Assignee: MKS Instruments Inc.Inventors: Souheil Benzerrouk, Siddharth P. Nagarkatti, Andrew Cowe, Ali Shajii, Jesse E. Ambrosina, Ken Tran, Xing Chen
-
Patent number: 8633782Abstract: A system and method are provided for delivering power to a dynamic load. The system includes a power supply providing DC power having a substantially constant power open loop response, a power amplifier for converting the DC power to RF power, a sensor for measuring voltage, current and phase angle between voltage and current vectors associated with the RF power, an electrically controllable impedance matching system to modify the impedance of the power amplifier to at least a substantially matched impedance of a dynamic load, and a controller for controlling the electrically controllable impedance matching system. The system further includes a sensor calibration measuring module for determining power delivered by the power amplifier, an electronic matching system calibration module for determining power delivered to a dynamic load, and a power dissipation module for calculating power dissipated in the electrically controllable impedance matching system.Type: GrantFiled: May 25, 2010Date of Patent: January 21, 2014Assignee: MKS Instruments, Inc.Inventors: Siddharth P. Nagarkatti, Michael Kishinevsky, Ali Shajii, Timothy E. Kalvaitis, William S. McKinney, Jr., Daniel Goodman, William M. Holber, John A. Smith
-
Patent number: 8624501Abstract: Methods, systems, and computer program products are described for measuring and controlling parameters of a plasma generator. A current in a primary winding of a transformer or inductive element that generates a plasma is measured. A voltage across a secondary winding of the transformer or inductive element is measured. Based on the current of the primary winding and the voltage across the secondary winding, a parameter of the plasma is determined. The parameter includes a resistance value associated with the plasma, a power value associated with the plasma, or both.Type: GrantFiled: December 8, 2010Date of Patent: January 7, 2014Assignee: MKS Instruments, Inc.Inventors: Siddharth P. Nagarkatti, Ali Shajii, Souheil Benzerrouk
-
Publication number: 20130025788Abstract: A processing chamber including multiple plasma sources in a process chamber top. Each one of the plasma sources is a ring plasma source including a primary winding and multiple ferrites. A plasma processing system is also described. A method of plasma processing is also described.Type: ApplicationFiled: September 26, 2012Publication date: January 31, 2013Inventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William Entley
-
Publication number: 20120262064Abstract: A system and method are provided for delivering power to a dynamic load. The system includes a power supply providing DC power having a substantially constant power open loop response, a power amplifier for converting the DC power to RF power, a sensor for measuring voltage, current and phase angle between voltage and current vectors associated with the RF power, an electrically controllable impedance matching system to modify the impedance of the power amplifier to at least a substantially matched impedance of a dynamic load, and a controller for controlling the electrically controllable impedance matching system. The system further includes a sensor calibration measuring module for determining power delivered by the power amplifier, an electronic matching system calibration module for determining power delivered to a dynamic load, and a power dissipation module for calculating power dissipated in the electrically controllable impedance matching system.Type: ApplicationFiled: February 8, 2012Publication date: October 18, 2012Applicant: MKS Instruments, Inc.Inventors: Siddharth P. Nagarkatti, Yevgeniy Barskiy, Feng Tian, Ilya Bystryak
-
Publication number: 20120202408Abstract: A pressure control system remotely controls pressure within one or more remote zones, each respectively connected to an enclosure through a conduit, by controlling flow of a fluid into and out of each enclosure. The pressure of the fluid is measured within each enclosure. An estimated pressure within each zone is computed, as a function of the measured pressure in the enclosure and known characteristics of the conduit and the zone. For each zone, an inlet proportional valve and an outlet proportional valve of each enclosure is operated so as to control the input flow rate of the fluid into the respective enclosure and the output flow rate of the fluid out of the enclosure as a function of a pressure set point and the estimated pressure, thereby regulating pressure within the zone in accordance with the pressure set point.Type: ApplicationFiled: October 12, 2011Publication date: August 9, 2012Applicant: MKS Instruments, Inc.Inventors: Ali Shajii, Siddharth P. Nagarkatti, Gordon Hill
-
Publication number: 20120146508Abstract: Methods, systems, and computer program products are described for measuring and controlling parameters of a plasma generator. A current in a primary winding of a transformer or inductive element that generates a plasma is measured. A voltage across a secondary winding of the transformer or inductive element is measured. Based on the current of the primary winding and the voltage across the secondary winding, a parameter of the plasma is determined. The parameter includes a resistance value associated with the plasma, a power value associated with the plasma, or both.Type: ApplicationFiled: December 8, 2010Publication date: June 14, 2012Applicant: MKS Instruments, Inc.Inventors: Siddharth P. Nagarkatti, Ali Shajii, Souheil Benzerrouk
-
Publication number: 20120035766Abstract: A plasma source includes a ring plasma chamber, a primary winding around an exterior of the ring plasma chamber, multiple ferrites, wherein the ring plasma chamber passes through each of the ferrites and multiple plasma chamber outlets coupling the plasma chamber to a process chamber. Each one of the plasma chamber outlets having a respective plasma restriction. A system and method for generating a plasma are also described.Type: ApplicationFiled: August 6, 2010Publication date: February 9, 2012Inventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William R. Entley
-
Publication number: 20120034394Abstract: A plasma source includes a ring plasma chamber, a primary winding around an exterior of the ring plasma chamber and multiple ferrites, wherein the ring plasma chamber passes through each of the ferrites. A system and method for generating a plasma are also described.Type: ApplicationFiled: August 6, 2010Publication date: February 9, 2012Inventors: Ali Shajii, Richard Gottscho, Souheil Benzerrouk, Andrew Cowe, Siddharth P. Nagarkatti, William R. Entley