Patents by Inventor Sidharth Sidharth

Sidharth Sidharth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability
    Patent number: 6803653
    Abstract: A semiconductor structure includes a substrate and a semiconductor devices secured to the substrate. A stabilizing member is secured to the semiconductor device, and has a coefficient of thermal expansion which is substantially the same as the coefficient of thermal expansion of the substrate. The bending stiffness of the substrate is substantially the same as the bending stiffness of the stabilizing member, wherein: bending stiffness=Et3, with E=Young's modulus, and t=thickness. In another embodiment, a stabilizing member is secured to the substrate, and has a coefficient of thermal expansion which is substantially the same as the coefficient of thermal expansion of the die. The bending stiffness of the die is substantially the same as the bending stiffness of the stabilizing member, with bending stiffness defined as above.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: October 12, 2004
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Robert E. Likins, Richard C. Blish, II, Sharad M. Shah, Sidharth Sidharth, Devendra Natekar