Abstract: A method is provided for electrodepositing a layer of copper on a plastic substrate which method comprises: positioning the plastic substrate on a supporting member, with the supporting member being in contact at a plurality of spaced apart points with the substrate for the passage of electrical current therebetween; electrolessly depositing a thin layer of metal selected from the group consisting of copper, nickel, cobalt and mixtures thereof on a surface of the plastic substrate; positioning the supported substrate in an electroplating bath including from about 10.0 to about 45.0 g/l of copper ions, at least one acid selected from the group consisting of sulfuric acid, fluoroboric acid and sulfamic acid, with the acid being present in an amount sufficient to cause the electroplating bath to have a conductivity ranging from about 0.40 to about 0.

Abstract: A composite particle is provided which comprises a matrix of puffed borax having a porous surface, with the matrix having retained on the porous surface thereof a plurality of individual grains of metal oxide. A method of producing such a composite particle is also provided.

Abstract: A process is provided for the electrodeposition of alloys of tin and lead by passing electrical current through an anode, an aqueous acidic plating solution and a cathode, wherein the aqueous acidic plating bath includes at least one organic compound having a formula ##STR1## wherein X=O, S, or NH and R.sub.2 and R.sub.3 are H, or lower alkyl and R.sub.1 is ##STR2## .

Abstract: A method is provided for depositing on a gravure roll a layer of copper especially adapted to receive electronic engraving comprising the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 grams/liter of copper sulfate from about 35 to about 90 grams/liter of sulfuric acid, from about 1 to about 15 grams/liter of a polyether having a molecular weight from about 4,000 to about 10,000, from about 0.3 to about 3.0 milligrams/liter of 1-lower alkyl-2-mercapto imidazole, and from about 1 to about 100 milligrams/liter of a sulfonated, sulfurized benzene compound; and passing electrical current through the bath to deposit copper on said roll.