Patents by Inventor Sidney Clouser

Sidney Clouser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for improving adhesion of resistive foil to laminating materials
    Patent number: 6824880
    Abstract: The invention relates to a process to enhance adhesion of resistive foil to laminating materials, including: providing a copper foil; depositing at least one resistive metal layer on at least one side of the copper foil; and applying at least one layer of at least one adhesion-promoting material over and adhered to the resistive metal layer, the adhesion-promoting material being suitable for enhancing adhesion between the resistive metal layer and laminating materials. The resistive metal layer may include NiCr, NiCrAlSi, aluminum, nickel, zinc, titanium, vanadium, chromium, manganese, iron, tantalum, molybdenum, ruthenium, and alloys, oxides, nitrides and silicides thereof. The invention further relates to a multilayer foil and to a laminate, both including the resistive metal layer and adhesion-promoting material.
    Type: Grant
    Filed: May 15, 2003
    Date of Patent: November 30, 2004
    Assignee: Ga-Tek, Inc.
    Inventors: Atnaf Admasu, Jiangtao Wang, Sidney Clouser