Abstract: There is provided a device which is principally used for trimming to a predetermined length the leads on electronics components prior to their insertion and connection to a printed circuit board. The device comprises a housing, in which is disposed positioning means and a movable plunger to which is attached a cutter blade. Also in contact therewith are resilient urging means to maintain close contact for effective shear cutting between the cutter blade and a die removably, but in fixed position, attached to the housing. The die incorporates holes or perforations into which the component leads are inserted for trimming, a plurality of holes normally being utilized in positions that correspond to the position of such leads on said component. The die is also a predetermined thickness, which thickness establishes the lengths to which the leads are trimmed in accordance with the specifications and thickness of the PC board to which the component will subsequently be soldered.