Patents by Inventor Sidney Hu

Sidney Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9666750
    Abstract: Photovoltaic cells having copper contacts can be made by using copper nanoparticles during their fabrication. Such photovoltaic cells can include a copper-based current collector located on a semiconductor substrate having an n-doped region and a p-doped region. The semiconductor substrate is configured for receipt of electromagnetic radiation and generation of an electrical current therefrom. The copper-based current collector includes an electrically conductive diffusion barrier disposed on the semiconductor substrate and a copper contact disposed on the electrically conductive diffusion barrier. The copper contact is formed from copper nanoparticles that have been at least partially fused together. The electrically conductive diffusion barrier limits the passage of copper therethrough.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: May 30, 2017
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: Alfred A. Zinn, Andrew Fried, Sidney Hu
  • Publication number: 20150255663
    Abstract: Photovoltaic cells having copper contacts can be made by using copper nanoparticles during their fabrication. Such photovoltaic cells can include a copper-based current collector located on a semiconductor substrate having an n-doped region and a p-doped region. The semiconductor substrate is configured for receipt of electromagnetic radiation and generation of an electrical current therefrom. The copper-based current collector includes an electrically conductive diffusion barrier disposed on the semiconductor substrate and a copper contact disposed on the electrically conductive diffusion barrier. The copper contact is formed from copper nanoparticles that have been at least partially fused together. The electrically conductive diffusion barrier limits the passage of copper therethrough.
    Type: Application
    Filed: May 22, 2015
    Publication date: September 10, 2015
    Inventors: Alfred A. ZINN, Andrew Fried, Sidney Hu