Patents by Inventor Sidney Huey
Sidney Huey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20060088976Abstract: Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate comprising a dielectric material and polysilicon material disposed thereon, polishing the polysilicon material with a high topography selective polishing composition, and polishing the polysilicon material with a material selective composition.Type: ApplicationFiled: October 22, 2004Publication date: April 27, 2006Inventors: Garrett Sin, Winston Su, Sidney Huey
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Publication number: 20060088999Abstract: Methods and compositions are provided for planarizing a substrate surface with reduced or minimal defects in surface topography. In one aspect, a method is provided for processing a substrate comprising a dielectric material and polysilicon material disposed thereon, polishing the polysilicon material with a high topography selective polishing composition, and polishing the polysilicon material with a material selective composition.Type: ApplicationFiled: November 14, 2005Publication date: April 27, 2006Inventors: Garrett Sin, Winston Su, Sidney Huey
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Publication number: 20050191947Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.Type: ApplicationFiled: November 12, 2004Publication date: September 1, 2005Inventors: Hung Chen, Steven Zuniga, Charles Garretson, Douglas McAllister, Jian Lin, Stacy Meyer, Sidney Huey, Jeonghoon Oh, Trung Doan, Jeffrey Schmidt, Martin Wohlert, Kerry Hughes, James Wang, Danny Cam Lu, Romain Beau De Lamenie, Venkata Balagani, Aden Allen, Michael Fong
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Publication number: 20050109371Abstract: A cleaning apparatus is provided for brush cleaning a surface of a substrate. The apparatus comprises a first brush having a first surface geometry adapted to scrub a major surface of the substrate, and a second brush having a second surface geometry different from the first surface geometry and adapted to scrub the major surface of the substrate. In one aspect the cleaning apparatus comprises a first scrubbing apparatus having at least one brush with a profiled surface geometry, adapted to scrub a major surface of a substrate, and a second scrubbing apparatus having at least one brush with a smooth surface geometry, adapted to scrub a major surface of a substrate. Numerous other aspects are provided.Type: ApplicationFiled: October 26, 2004Publication date: May 26, 2005Inventors: Garrett Sin, Terry Ko, Sidney Huey
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Publication number: 20040053566Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: ApplicationFiled: July 15, 2003Publication date: March 18, 2004Applicant: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
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Patent number: 6592438Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: GrantFiled: January 12, 2001Date of Patent: July 15, 2003Assignee: Applied Materials Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
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Patent number: 6527624Abstract: A carrier head of a chemical mechanical polishing apparatus to apply and distribute a polishing slurry to a polishing pad. The retaining ring includes a trough and one or more channels to channel the polishing slurry to the polishing pad.Type: GrantFiled: October 19, 1999Date of Patent: March 4, 2003Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Sidney Huey
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Patent number: 6361405Abstract: A utility wafer, more specifically, an utility wafer for simulating a workpiece in a semiconductor processing system. The utility wafer includes a first side, a second side and a peripheral edge wherein one or both edges of the peripheral edge are relieved to remove the otherwise sharp edge. In one embodiment, the peripheral edge is polished. The utility wafer is resistant to chipping, stress cracking and breakage when undergoing chemical mechanical planarization.Type: GrantFiled: April 6, 2000Date of Patent: March 26, 2002Assignee: Applied Materials, Inc.Inventors: Jeffrey D. David, Benjamin A. Bonner, Thomas H. Osterheld, Sidney Huey
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Publication number: 20020028635Abstract: A utility wafer, more specifically, an utility wafer for simulating a workpiece in a semiconductor processing system. The utility wafer includes a first side, a second side and a peripheral edge wherein one or both edges of the peripheral edge are relieved to remove the otherwise sharp edge. In one embodiment, the peripheral edge is polished. The utility wafer is resistant to chipping, stress cracking and breakage when undergoing chemical mechanical planarization.Type: ApplicationFiled: April 6, 2000Publication date: March 7, 2002Applicant: DAVID et alInventors: Jeffrey D. David, Benjamin A. Bonner, Thomas H. Osterheld, Sidney Huey
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Patent number: 6322427Abstract: The useful lifetime of a fixed abrasive article is extended and wafer-to-wafer uniformity enhanced by preconditioning a fixed abrasive element and/or periodic conditioning after initial wafer polishing. Embodiments include preconditioning by forced removal of an upper binder-rich portion of the fixed abrasive elements to expose abrasive particles having a similar concentration as the bulk concentration at about one half the height of the elements. Embodiments further include periodic conditioning after initial wafer polishing by forced removal of an upper portion of the fixed abrasive elements.Type: GrantFiled: April 30, 1999Date of Patent: November 27, 2001Assignee: Applied Materials, Inc.Inventors: Shijian Li, Sidney Huey, Ramin Emami, Fritz Redeker, John White
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Patent number: 6283840Abstract: A cleaning and slurry distribution assembly for use in a chemical mechanical polishing apparatus. The cleaning assembly includes a plurality of nozzles for directing a cleaning fluid against a polishing pad. The cleaning assembly further includes a housing for containing residual droplets, slurry and contaminants. The slurry distribution assembly includes a ring for optimally distributing slurry on the polishing pad.Type: GrantFiled: August 3, 1999Date of Patent: September 4, 2001Assignee: Applied Materials, Inc.Inventor: Sidney Huey
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Publication number: 20010005667Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: ApplicationFiled: January 12, 2001Publication date: June 28, 2001Applicant: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker
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Patent number: 6220941Abstract: The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.Type: GrantFiled: October 1, 1998Date of Patent: April 24, 2001Assignee: Applied Materials, Inc.Inventors: Boris Fishkin, Charles C. Garretson, Peter McKeever, Thomas H. Osterheld, Gopalakrishna B. Prabhu, Doyle E. Bennett, Benjamin A. Bonner, Sidney Huey
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Patent number: 6220942Abstract: A chemical mechanical polishing system is provided having one more polishing stations. The polishing stations include a platen and pad mounted to an upper surface of the platen. The upper surface of the platen is patterned to define a raised area and a recessed area. The raised area provides a rigid mounting surface for the pad and the recessed area provides the pad a desired degree of flexibility and compliance of the pad when brought into contact with a substrate.Type: GrantFiled: April 2, 1999Date of Patent: April 24, 2001Assignee: Applied Materials, Inc.Inventors: Robert D. Tolles, Steven T. Mear, Gopalakrishna B. Prabhu, Sidney Huey, Fred C. Redeker