Abstract: There is described a new "one-step" bis A-formaldehyde resin, and a molding material containing the resin with which one may achieve molded products possessing excellent properties and almost optimum molding characteristics such as excellent molding latitude, low degree of mold shrinkage, high modulus at elevated temperature, a low degree of deformation at elevated temperatures, and excellent steam crack resistance and electrical properties. The molding material comprises a light colored bis-A formaldehyde resin and reinforcing filler for the resin. The resin is a heat convertible resin (resole) which comprises the product of the reaction of formaldehyde and bis A in the mole ratio of about 2 to about 3.75, in the presence of a catalytic amount of an alkali metal hydroxide or barium hydroxide condensation catalyst. The molding material of this invention is particularly desirable in making molded products by the injection molding or transfer molding processes.