Patents by Inventor Sidney Kwun Wa Leung

Sidney Kwun Wa Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120133069
    Abstract: The present invention provides a vacuum thermoforming process-combined one-step molding method for expandable polypropylene, comprising the steps of silk screen printing on a plastic sheet, subjecting the plastic sheet to vacuum thermoforming to provide a vacuum thermoforming part, and foaming an expandable polypropylene and integratedly molding the expandable polypropylene with the vacuum thermoforming part. The expandable polypropylene vacuum thermoforming product produced by the method according to the present invention exhibits an improved impact resistance, and the production process is more superior.
    Type: Application
    Filed: May 26, 2011
    Publication date: May 31, 2012
    Inventors: Sidney Kwun Wa Leung, Eric Tang
  • Publication number: 20100181008
    Abstract: The present invention provides a vacuum thermoforming process-combined secondary molding method for expandable polypropylene, the method comprises the steps of silk screen printing on a blister sheet, vacuum thermoforming of the blister sheet to provide a thermoforming part, foam molding of expandable polypropylene to provide a EPP foam part, spray coating the surface of the EPP foam part with ink, and integrate molding of the EPP foam part and the thermoforming part. The expandable polypropylene blister product produced by this method exhibits good impact resistance and possesses good appearance.
    Type: Application
    Filed: January 20, 2010
    Publication date: July 22, 2010
    Inventors: Eric Tang, Sidney Kwun Wa Leung