Patents by Inventor Sidney T. Faulkner

Sidney T. Faulkner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6154364
    Abstract: A process and circuit board assembly by which a single soldering operation produces a multicomponent stack capable of dissipating heat from a power IC chip (12) mounted to a substrate (10). The circuit board assembly generally includes a number of conductors (16) on the substrate (10), with the conductors (16) being spaced apart and substantially parallel to each other. A heat spreader (14) is soldered to at least some of the conductors (16), and the chip (12) is soldered to the heat spreader (14). With this structure, heat is conducted from the chip (12) through the heat spreader (14) and conductors (16) to the substrate (10). To maintain proper orientation of the components (12, 14, 16) relative to each other during a single soldering operation, the components (12, 14, 16) are equipped with complementary features.
    Type: Grant
    Filed: November 19, 1998
    Date of Patent: November 28, 2000
    Assignee: Delco Electronics Corp.
    Inventors: Troy M. Girrens, Robert Gordon Fessenden, Dianne K. Ruch, Thomas P. Douglas, Timothy J. Guse, Billy R. Colwell, Sidney T. Faulkner