Abstract: A monitoring apparatus for the eye has a soft contact lens formed of a transparent substrate having an inner surface that faces the eye and an outer surface. A first arcuate pattern of resistive traces is formed onto the outer surface of the lens substrate and centered about the center of the lens. A second arcuate pattern of resistive traces is formed onto the inner surface of the lens substrate and centered about the center of the lens. One or more conductive traces connects the first pattern to the second pattern. A signal monitor is in signal communication with the first and second arcuate patterns of resistive traces and provides a signal indicative of the lens shape according to electrical current through the first and second arcuate patterns of resistive traces.

Abstract: A monitoring apparatus for the eye has a soft contact lens formed of a transparent substrate having an inner surface that faces the eye and an outer surface. A first arcuate pattern of resistive traces is formed onto the outer surface of the lens substrate and centered about the center of the lens. A second arcuate pattern of resistive traces is formed onto the inner surface of the lens substrate and centered about the center of the lens. One or more conductive traces connects the first pattern to the second pattern. A signal monitor is in signal communication with the first and second arcuate patterns of resistive traces and provides a signal indicative of the lens shape according to electrical current through the first and second arcuate patterns of resistive traces.

Abstract: Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided. According to one embodiment, a method for varying the capacitance of two conductive plates is provided. The method can include providing a micro-electro-mechanical system (MEMS) variable capacitor. The variable capacitor can include first and second actuation electrodes wherein one of the actuation electrodes is movable with respect to the other actuation electrode when a voltage is applied across the first and second actuation electrodes. Further, the variable capacitor can include first and second capacitive electrodes. The method can include applying a voltage to the first and second actuation electrodes for movement of at least one of the capacitive electrodes in a substantially straight direction with respect to the other capacitive electrode upon application of voltage across the first and second actuation electrodes to change the capacitance between the first and second capacitive electrodes.

Abstract: Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided. According to one embodiment, a method for varying the capacitance of two conductive plates is provided. The method can include providing a micro-electro-mechanical system (MEMS) variable capacitor. The variable capacitor can include first and second actuation electrodes wherein one of the actuation electrodes is movable with respect to the other actuation electrode when a voltage is applied across the first and second actuation electrodes. Further, the variable capacitor can include first and second capacitive electrodes. The method can include applying a voltage to the first and second actuation electrodes for movement of at least one of the capacitive electrodes in a substantially straight direction with respect to the other capacitive electrode upon application of voltage across the first and second actuation electrodes to change the capacitance between the first and second capacitive electrodes.

Abstract: Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided.

Abstract: Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided. According to one embodiment, a method for varying the capacitance of two conductive plates is provided. The method can include providing a micro-electro-mechanical system (MEMS) variable capacitor. The variable capacitor can include first and second actuation electrodes wherein one of the actuation electrodes is movable with respect to the other actuation electrode when a voltage is applied across the first and second actuation electrodes. Further, the variable capacitor can include first and second capacitive electrodes. The method can include applying a voltage to the first and second actuation electrodes for movement of at least one of the capacitive electrodes in a substantially straight direction with respect to the other capacitive electrode upon application of voltage across the first and second actuation electrodes to change the capacitance between the first and second capacitive electrodes.

Abstract: A switch pad for switching signal flow and a micro-switch having the same. The switch pad comprises a body formed so that as approaching opposite end portions from a central portion of the body, the body is more remotely spaced from a horizontal plane containing a top surface of the electrostatic driving unit. With the body of the switch pad formed in this manner, the switch pad can be more stably driven.

Abstract: Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided. According to one embodiment, a method for varying the capacitance of two conductive plates is provided. The method can include providing a micro-electro-mechanical system (MEMS) variable capacitor. The variable capacitor can include first and second actuation electrodes wherein one of the actuation electrodes is movable with respect to the other actuation electrode when a voltage is applied across the first and second actuation electrodes. Further, the variable capacitor can include first and second capacitive electrodes. The method can include applying a voltage to the first and second actuation electrodes for movement of at least one of the capacitive electrodes in a substantially straight direction with respect to the other capacitive electrode upon application of voltage across the first and second actuation electrodes to change the capacitance between the first and second capacitive electrodes.

Abstract: Micro-electro-mechanical system (MEMS) variable capacitor apparatuses, system and related methods are provided.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

Abstract: A Micromechanical Microphone is formed with a housing and a transducer therein. The housing has a sound inlet on one side of the transducer and a pressure compensation hole on the opposite side. A sealing diaphragm is placed on each side of the transducer to seal it against humidity, dust and dirt. The transducer may be a capacitive transducer with an external bias or an electret based transducer. The microphone is useful in small devices such as hearing aides.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.