Patents by Inventor Siegfried Foerstner

Siegfried Foerstner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8231254
    Abstract: A lighting unit for vehicle headlights comprising a light-emitting diode device (500), and a housing (200), in the interior of which are arranged components of an operating circuit for operating the light-emitting diode device (500), wherein the housing (200) is composed of electrically insulating material, electrical connections (222) for the voltage supply of the lighting unit are embedded in the housing (200), and the housing (200) has adjustment means (213a, 213b, 213c) for orienting the lighting unit in a vehicle headlight; wherein the light-emitting diode device (500) is arranged on a surface (112) of a heat sink (100) composed of thermally conductive material; and wherein the heat sink (100) forms a bearing surface (120a) for an external cooling system, said bearing surface being arranged at an outer side of the housing.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: July 31, 2012
    Assignee: Osram AG
    Inventors: Jürgen Beck, Siegfried Foerstner, Peter Frey, Christian Meier
  • Publication number: 20110103076
    Abstract: A lighting unit for vehicle headlights comprising a light-emitting diode device (500), and a housing (200), in the interior of which are arranged components of an operating circuit for operating the light-emitting diode device (500), wherein the housing (200) is composed of electrically insulating material, electrical connections (222) for the voltage supply of the lighting unit are embedded in the housing (200), and the housing (200) has adjustment means (213a, 213b, 213c) for orienting the lighting unit in a vehicle headlight; wherein the light-emitting diode device (500) is arranged on a surface (112) of a heat sink (100) composed of thermally conductive material; and wherein the heat sink (100) forms a bearing surface (120a) for an external cooling system, said bearing surface being arranged at an outer side of the housing
    Type: Application
    Filed: June 16, 2009
    Publication date: May 5, 2011
    Applicant: OSRAM GESELLSCHAFT MIT BESCHRANKTER HAFTUNG
    Inventors: Jüergen Beck, Siegfried Foerstner, Peter Frey, Christian Maier