Abstract: The invention relates to a combined pump-sensor arrangement having a substrate having a first main surface and an opposite second main surface. A package lid which defines a package having a measuring cavity is arranged on the first main surface of the substrate. Additionally, the pump-sensor arrangement has a micropump having a pump inlet and a pump outlet, the micropump being configured to suck in an analyte fluid present in the measuring cavity through the pump inlet and eject the same to an environment outside the measuring cavity via the pump outlet. Furthermore, the pump-sensor arrangement has a sensor for detecting at least one component of the analyte fluid present within the measuring cavity and movable by means of the micropump. In accordance with the invention, both the sensor and the micropump are commonly arranged on the first main surface of the substrate and within the measuring cavity.

Abstract: A method for producing a micropump includes, among others, a step of providing a substrate, wherein the substrate includes at least one pump diaphragm for the micropump. Additionally, a diaphragm actuator for moving the pump diaphragm is provided, wherein the diaphragm actuator is arranged in an holding device. The holding device is aligned relative to the substrate such that the diaphragm actuator is arranged opposite to the pump diaphragm and the pump diaphragm is deflected in the direction of the diaphragm actuator by means of a fluid pressure that is higher than the ambient pressure. Additionally, the diaphragm actuator is mounted on the pump diaphragm.

Abstract: The invention relates to a combined pump-sensor arrangement having a substrate having a first main surface and an opposite second main surface. A package lid which defines a package having a measuring cavity is arranged on the first main surface of the substrate. Additionally, the pump-sensor arrangement has a micropump having a pump inlet and a pump outlet, the micropump being configured to suck in an analyte fluid present in the measuring cavity through the pump inlet and eject the same to an environment outside the measuring cavity via the pump outlet. Furthermore, the pump-sensor arrangement has a sensor for detecting at least one component of the analyte fluid present within the measuring cavity and movable by means of the micropump. In accordance with the invention, both the sensor and the micropump are commonly arranged on the first main surface of the substrate and within the measuring cavity.

Abstract: A mobile device includes an opening defining a fluid connection between a fluid channel in the mobile device and ambient air, and a sensor arranged in the fluid channel, configured to sense at least one component of the ambient air. The mobile device further includes a micropump configured to draw in the ambient air through the opening and to convey the same to the sensor. According to the invention, the sensor is arranged spaced apart from the opening, and the volume of the fluid channel between the sensor and the opening is less than 200 microliters.

Abstract: An electrically conductive element includes an electrically conductive material and a plurality of inclusions of a phase change material. The phase change material has a phase transition temperature Tc between 150° C. and 400° C. The inclusions are separated from each other and are embedded in the electrically conductive material.

Abstract: A mobile device includes an opening defining a fluid connection between a fluid channel in the mobile device and ambient air, and a sensor arranged in the fluid channel, configured to sense at least one component of the ambient air. The mobile device further includes a micropump configured to draw in the ambient air through the opening and to convey the same to the sensor. According to the invention, the sensor is arranged spaced apart from the opening, and the volume of the fluid channel between the sensor and the opening is less than 200 microliters.

Abstract: An electrically conductive element includes an electrically conductive material and a plurality of inclusions of a phase change material. The phase change material has a phase transition temperature Tc between 150° C. and 400° C. The inclusions are separated from each other and are embedded in the electrically conductive material.

Abstract: A conductor layer is patterned into flat portions, for example of a fingerprint sensor that effects capacitive measurement. The conductor layer is fragmented in a lattice-like manner by cutouts so that an applied passivation layer rests on a base layer that is present beneath the conductor layer. The interlaminar shear strength of the passivation is increased in this way.

Abstract: A method of forming a capped and borderless contact of polysilicon on a body of a semiconductor material includes depositing a layer of undoped polysilicon on the surface of the body and forming an opening therethrough to the surface of the body. The side walls of the opening are then coated with a layer of silicon nitride and the opening is then filled with doped polysilicon which forms the contact. The doped and undoped polysilicon are heated in an oxidizing atmosphere to grow a layer of silicon dioxide thereon having a thicker portion over the doped polysilicon then over the undoped polysilicon. The silicon dioxide layer is etched to remove the thinner portion leaving the thicker portion over the doped polysilicon as a capping layer. The undoped polysilicon is then etched away and a layer of a dielectric material is deposited on the body and surrounding the doped polysilicon contact.

Abstract: Method for manufacturing a trench capacitor of a one-transistor memory cell in a semiconductor substrate with a self-aligned cooperating capacitor electrode. In a one-transistor memory cell having a trench capacitor in a semiconductor substrate (1), a field oxide (3) that isolates different cells is exploited for a self-aligning process. After the formation of a first electrode and of a dielectrode (5) of the capacitor, a conductive layer (6) is applied surface-wide, the upper edge thereof being higher over the field oxide (3) than over the field-oxide-free locations of the substrate (1). The raised location is exposed in a re-etching process upon employment of a planarizing auxiliary layer (9), and a sub-layer (10, 10') is selectively applied thereon, either by local oxidation, selective or non-selective deposition. This sub-layer (10, 10') serves as a self-aligned mask for the structuring of the conductive layer (6) as a cooperating electrode of the trench capacitor.