Abstract: A semiconductor rectifier which is embodied substantially in a rotationally symmetrical manner is proposed. The semiconductor rectifier includes a semiconductor chip (10) and two connector leads (11, 12), each of which is soldered to one of the two main surfaces of the semiconductor chip (10). The first lead (11) forms a bolt-like, solid metal base, which comprises a first part (11a) soldered to the semiconductor chip (10) and a second part (11b) provided with knurling. The second lead (12) is embodied as a head wire and the head portion (12a) of this head wire is soldered to the semiconductor chip (10). A synthetic resin mass (13) is furthermore provided, which covers the rim of the semiconductor chip (10), the first part (11a) of the first lead (11) and portions of the second lead (12). The second part (11b) of the first lead (11) is pressed into a cooling plate (14) serving to cool the rectifier.