Patents by Inventor Siegfried TOMASCHKO
Siegfried TOMASCHKO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10955440Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.Type: GrantFiled: September 5, 2019Date of Patent: March 23, 2021Assignee: International Business Machines CorporationInventors: Martin Eckert, Roland Dieterle, Siegfried Tomaschko
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Patent number: 10605649Abstract: The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.Type: GrantFiled: March 14, 2019Date of Patent: March 31, 2020Assignee: International Business Machines CorporationInventors: Martin Eckert, Siegfried Tomaschko, Roland Dieterle
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Patent number: 10527649Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.Type: GrantFiled: July 14, 2017Date of Patent: January 7, 2020Assignee: International Business Machines CorporationInventors: Martin Eckert, Roland Dieterle, Siegfried Tomaschko
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Publication number: 20190391179Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.Type: ApplicationFiled: September 5, 2019Publication date: December 26, 2019Inventors: Martin Eckert, Roland Dieterle, Siegfried Tomaschko
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Patent number: 10422817Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.Type: GrantFiled: October 27, 2017Date of Patent: September 24, 2019Assignee: International Business Machines CorporationInventors: Martin Eckert, Roland Dieterle, Siegfried Tomaschko
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Patent number: 10345136Abstract: The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.Type: GrantFiled: July 14, 2017Date of Patent: July 9, 2019Assignee: International Business Machines CorporationInventors: Martin Eckert, Siegfried Tomaschko, Roland Dieterle
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Publication number: 20190204138Abstract: The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.Type: ApplicationFiled: March 14, 2019Publication date: July 4, 2019Inventors: Martin Eckert, Siegfried Tomaschko, Roland Dieterle
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Publication number: 20190018043Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.Type: ApplicationFiled: July 14, 2017Publication date: January 17, 2019Inventors: Martin Eckert, Roland Dieterle, Siegfried Tomaschko
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Publication number: 20190018044Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.Type: ApplicationFiled: October 27, 2017Publication date: January 17, 2019Inventors: Martin Eckert, Roland Dieterle, Siegfried Tomaschko
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Publication number: 20190017861Abstract: The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.Type: ApplicationFiled: July 14, 2017Publication date: January 17, 2019Inventors: Martin Eckert, Siegfried Tomaschko, Roland Dieterle
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Patent number: 10146144Abstract: The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non- parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.Type: GrantFiled: October 27, 2017Date of Patent: December 4, 2018Assignee: International Business Machines CorporationInventors: Martin Eckert, Siegfried Tomaschko, Roland Dieterle
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Patent number: 10082526Abstract: An adjustable load transmitter for adjusting an alignment between a probe card and a bridge beam of a wafer prober, where the probe card is separated from the bridge beam by a gap. The adjustable load transmitter located in the gap, the adjustable load transmitter comprising two rotatable plates adapted for transmitting a load via a load transmission path between the bridge beam and the wafer prober and each comprising two flat, non-parallel contact faces. The adjustable load transmitter removes an angular misalignment between the bridge beam and the set of plates by rotating each of the rotatable plates about a pre-determined adjustment angle such that two angles of inclination are adjusted to zero. The adjustable load transmitter establishes the load transmission path by closing a clearance between the bridge beam and the contact face.Type: GrantFiled: December 29, 2017Date of Patent: September 25, 2018Assignee: International Business Machines CorporationInventors: Martin Eckert, Roland Dieterle, Siegfried Tomaschko
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Patent number: 10082419Abstract: The disclosure relates to an adjustable load transmitter for adjusting an alignment between planar members separated from each other by a gap. The load transmitter comprises a set of plates to be received inside the gap, the set comprising two rotatable plates and being adapted for transmitting a load via a load transmission path between the planar members. The load transmission path comprises the rotatable plates. Each of the plates comprises two flat, non-parallel contact faces, and one of the contact faces of the first rotatable plate is in permanent surface contact with one of the contact faces of the second rotatable plate. The rotatable plates are adapted for being rotated relative to each other around one of their respective normal axes.Type: GrantFiled: December 29, 2017Date of Patent: September 25, 2018Assignee: International Business Machines CorporationInventors: Martin Eckert, Siegfried Tomaschko, Roland Dieterle
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Patent number: 9977053Abstract: A wafer probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.Type: GrantFiled: June 8, 2016Date of Patent: May 22, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera, Siegfried Tomaschko, Otto Torreiter, Quintino Lorenzo Trianni
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Patent number: 9927463Abstract: A water probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.Type: GrantFiled: October 20, 2015Date of Patent: March 27, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Joerg G. Appinger, Eberhard Dengler, Roland Dieterle, Martin Eckert, Gabriele Kuczera, Siegfried Tomaschko, Otto Torreiter, Quintino Lorenzo Trianni
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Patent number: 9921268Abstract: A test probe aligner for aligning a test probe card with devices under test of a wafer is provided. The test probe aligner includes a backer plate arranged with its bottom side to the test probe card, and a stiffener mounted to the test probe card outside a horizontal dimension of the backer plate. The stiffener and a top side of the backer plate end in a same plane above the test probe card. The alignment further includes a bridge beam locked to a top side of the stiffener. Furthermore, the test probe aligner also includes at least two actuators and at least two corresponding force measurement sensors below a top surface of the bridge beam, arranged such that forces are applicable to the test probe card.Type: GrantFiled: November 18, 2015Date of Patent: March 20, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Eberhard Dengler, Gabriele Kuczera, Eckhard Kunigkeit, Siegfried Tomaschko, Quintino Lorenzo Trianni
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Publication number: 20170139003Abstract: A test probe aligner for aligning a test probe card with devices under test of a wafer is provided. The test probe aligner includes a backer plate arranged with its bottom side to the test probe card, and a stiffener mounted to the test probe card outside a horizontal dimension of the backer plate. The stiffener and a top side of the backer plate end in a same plane above the test probe card. The alignment further includes a bridge beam locked to a top side of the stiffener. Furthermore, the test probe aligner also includes at least two actuators and at least two corresponding force measurement sensors below a top surface of the bridge beam, arranged such that forces are applicable to the test probe card.Type: ApplicationFiled: November 18, 2015Publication date: May 18, 2017Inventors: Eberhard Dengler, Gabriele Kuczera, Eckhard Kunigkeit, Siegfried Tomaschko, Quintino Lorenzo Trianni
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Publication number: 20170108534Abstract: A water probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.Type: ApplicationFiled: October 20, 2015Publication date: April 20, 2017Inventors: Joerg G. APPINGER, Eberhard DENGLER, Roland DIETERLE, Martin ECKERT, Gabriele KUCZERA, Siegfried TOMASCHKO, Otto TORREITER, Quintino Lorenzo TRIANNI
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Publication number: 20170108547Abstract: A wafer probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.Type: ApplicationFiled: June 8, 2016Publication date: April 20, 2017Inventors: Joerg G. APPINGER, Eberhard DENGLER, Roland DIETERLE, Martin ECKERT, Gabriele KUCZERA, Siegfried TOMASCHKO, Otto TORREITER, Quintino Lorenzo TRIANNI