Abstract: An electrical arrangement has a first electrically conductive contact point (10) and a second electrically conductive contact point (20), the first and the second contact point being arranged at a distance (x) from one another and being electrically connected to one another via a wire connection arrangement (30), the wire connection arrangement (30) being formed by at least two wire connections (31-1, 31-2, . . . , 31-n-1, 31-n) which have respectively a first end (32-1, 32-1, 32-n-1, 32-n) and a second end (33-1, 33-2, . . . , 33-n-1, 33-3), and the first end of a wire connection (30-2, . . . , 30-n) and the second end of a preceding wire connection (30-1, . . . , 30-n-1) being in direct contact with one another.

Abstract: The invention relates to an assembly comprising a support, which bears a semiconductor chip that is connected to a metallized surface on the rear of the support by means of a through-plating. A first nail head contact, from which the connection wire has been separated, is formed on the through-plating. A second nail head contact is formed on a connection pad of the semiconductor chip. The wire that connects the semiconductor to the through-plating runs from said second nail head contact to the first nail head contact and is connected to the latter by means of a wedge contact.

Abstract: The invention relates to an assembly comprising a support, which bears a semiconductor chip that is connected to a metallized surface on the rear of the support by means of a through-plating. A first nail head contact, from which the connection wire has been separated, is formed on the through-plating. A second nail head contact is formed on a connection pad of the semiconductor chip. The wire that connects the semiconductor to the through-plating runs from said second nail head contact to the first nail head contact and is connected to the latter by means of a wedge contact.