Patents by Inventor Sien WU

Sien WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12669293
    Abstract: A vapor chamber with a support structure is provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: June 30, 2026
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Sien Wu, Baoxun He, Ti-Jun Wang
  • Publication number: 20230339053
    Abstract: A vapor chamber with a support structure is provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
    Type: Application
    Filed: June 27, 2023
    Publication date: October 26, 2023
    Inventors: Shih-Lin HUANG, Sien WU, Baoxun HE, Ti-Jun WANG
  • Patent number: 11731220
    Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: August 22, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Sien Wu, Baoxun He, Ti-Jun Wang
  • Publication number: 20210247153
    Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
    Type: Application
    Filed: April 28, 2021
    Publication date: August 12, 2021
    Inventors: Shih-Lin HUANG, Sien WU, Baoxun HE, Ti-Jun WANG
  • Publication number: 20190249938
    Abstract: A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 15, 2019
    Inventors: Shih-Lin HUANG, Sien WU, Baoxun HE, Ti-Jun WANG
  • Patent number: 10145619
    Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: December 4, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen, Sien Wu, Ti-Jun Wang
  • Publication number: 20180038659
    Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
    Type: Application
    Filed: October 13, 2017
    Publication date: February 8, 2018
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sien WU, Ti-Jun WANG
  • Publication number: 20160201992
    Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.
    Type: Application
    Filed: May 5, 2015
    Publication date: July 14, 2016
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sien WU, Ti-Jun WANG
  • Publication number: 20160153722
    Abstract: A heat pipe comprises a first pipe and at least a second pipe. The first pipe includes an evaporator, a heat insulator and a condenser communicating with each other to define a hollow chamber. Two ends of first pipe along an axial direction of the heat pipe are sealed. The second pipe is disposed in the hollow chamber and includes an accommodating space and a first capillary structure disposed in one end of the accommodating space closer to the evaporator. The hollow chamber of the first pipe is mainly a channel for vapor, the second pipe is mainly a channel for working fluid, the vapor is driven by the vapor pressure difference to move in the first pipe and from the evaporator to the condenser, and the working fluid is driven by the vapor pressure difference to flow in the second pipe and from the condenser to the evaporator.
    Type: Application
    Filed: July 7, 2015
    Publication date: June 2, 2016
    Inventors: Shih-Lin HUANG, Chiu-Kung CHEN, Sien WU, Ti-Jun WANG