Patents by Inventor Siew Ling KOH

Siew Ling KOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11855607
    Abstract: An electro-acoustic resonator comprises a piezoelectric substrate on which an electrode structure is disposed. The electrode structure comprises a metal layer of aluminum and copper, a barrier layer forming a barrier against the diffusion of copper and another metal layer disposed on the barrier layer comprising aluminum. An AlCu intermetallic phase formed after an anneal is restricted to the portion beneath the barrier layer so that Galvano-corrosion of the electrode structure is avoided.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: December 26, 2023
    Assignee: RF360 Singapore Pte. Ltd.
    Inventors: Matthias Honal, Tomasz Jewula, Pei Wen Qiao, Siew Li Poh, Siew Ling Koh
  • Publication number: 20210075397
    Abstract: An electro-acoustic resonator comprises a piezoelectric substrate on which an electrode structure is disposed. The electrode structure comprises a metal layer of aluminum and copper, a barrier layer forming a barrier against the diffusion of copper and another metal layer disposed on the barrier layer comprising aluminum. An AlCu intermetallic phase formed after an anneal is restricted to the portion beneath the barrier layer so that Galvano-corrosion of the electrode structure is avoided.
    Type: Application
    Filed: April 24, 2019
    Publication date: March 11, 2021
    Inventors: Matthias HONAL, Tomasz JEWULA, Pei Wen QIAO, Siew Li POH, Siew Ling KOH