Abstract: Illumination apparatus includes a support structure, at least one light emitting element, and a heat sink thermally coupled to the light emitting element. The light emitting element and heat sink are moveable in relation to the support structure. An actuator system moves the at least one light emitting element and the heat sink with respect to the support structure.

Abstract: A New Phosphor-converted LED Device (“NPCLD”) is disclosed. The NPCLD may include a lens over a phosphor body, in which the lens and the phosphor body each have a substantially convex upper surface. The NPCLD may alternatively include first and second lenses, the first lens having a substantially flat interface with a phosphor body.

Abstract: A flash module has a first light-emitting diode (“LED”) optically coupled to a first lens having a first viewing angle, and a second LED optically coupled to a second lens having a second viewing angle. The second viewing angle is greater than the first viewing angle. A first control signal line coupled to the first LED allows selectively activating the first LED. A second control signal line coupled to the second LED activates the second LED.

Abstract: A light source having light emitting modules coupled to a flexible circuit carrier. The flexible circuit carrier includes a sheet of flexible material having electrically conducting traces connecting a circuit mounting area and a connector region. The light emitting modules are electrically connected to the circuit mounting area. In one embodiment, the light emitting modules are arranged in a linear array. The light source preferably includes a light pipe having a planar layer of transparent material, the light emitting modules being bonded to an edge of the planar layer. The light pipe is preferably attached to a printed circuit board and the connection region of the flexible circuit carrier is attached to the printed circuit board. The flexible circuit carrier can move heat from the light emitting modules to the printed circuit board as well as providing electrical connections.

Abstract: A light emitting device package and method for making the package utilizes a first leadframe having a first surface and a second leadframe having a second surface that are relatively positioned such that the second surface is at a higher level than the first surface. The light emitting device package includes a light source, e.g., a light emitting diode die, which is mounted on the first surface of the first leadframe and electrically connected to the second surface of the second leadframe.

Abstract: In one embodiment, a light-emitting apparatus includes a plurality of adjacent, overlapping light-guide plates formed of substantially transparent material, and a plurality of light sources. Each of the light-guide plates has i) first and second ends, ii) one or more substantially transparent surfaces through which light is emitted, and iii) one or more reflective surfaces to redirect light within the light-guide plate. Where first and second light-guide plates are adjacent, the first end of the first light-guide plate A) underhangs the second end of the second light-guide plate, and B) is positioned opposite a primary light-emitting side of the apparatus. The plurality of light sources are optically coupled to the first ends of the light-guide plates so as to illuminate the interiors of the light-guide plates.

Abstract: In one embodiment, a light-emitting apparatus includes a substrate having i) a plurality of overlapping panels that form acute angles with respect to an imaginary surface that bisects the overlapping panels, and ii) a plurality of recesses formed between overlapping portions of the overlapping panels. The recesses are open to the first side of the substrate, and the first side of the substrate has a reflective surface. A plurality of light sources is positioned to emanate light from the recesses.

Abstract: A light source and a method for operating the same are disclosed. The light source includes a light emitter and a controller. The light emitter generates light in response to a control signal coupled thereto. The light emitter is characterized by an age related to the amount of light that has been cumulatively generated by the light emitter, the generated light for a given control signal changing with the age. The controller measures the age of the light emitter and generates the control signal based on the desired light intensity and the measured age of the light emitter. In one embodiment, the controller stores an age value for the light emitter, and the controller determines the control signal in response to an input signal specifying a desired light intensity from the light emitter, the controller updating the age value each time the control signal is determined.

Abstract: In one embodiment, apparatus is provided with at least one solid-state light emitter, at least one fiber optic light guide, at least one photosensor, and a control system. Each of the at least one fiber optic light guide has a first end that is independently positionable with respect to the solid-state light emitter(s) to receive the light emitted by the solid-state light emitter(s). Each photosensor is positioned to receive light emitted from a second end of one of the light guides. The control system is operably associated with the solid-state light emitter(s) and the photosensor(s) to regulate the light output of the light emitter(s) in accordance with measurements received from the photosensor(s).

Abstract: Illumination apparatus includes a support structure, at least one light emitting element, and a heat sink thermally coupled to the light emitting element. The light emitting element and heat sink are moveable in relation to the support structure. An actuator system moves the at least one light emitting element and the heat sink with respect to the support structure.

Abstract: A light emitting device includes a PCB substrate, an LED die that is attached to the PCB substrate, and a silicone-based encapsulation structure that encapsulates the LED die between the silicone-based encapsulation structure and the PCB substrate. The silicone-based material that is used to form the encapsulation structure exhibits low moisture absorption and a low elastic modulus relative to epoxy-based materials.