Abstract: In an embodiment, there is disclosed an opto-electronic package, comprising a substrate, a plurality of light emitting diode (LED) dice, and at least one lens disposed between the cavity-defining walls and having a maximum height remaining within an aperture of an elongate cavity of the substrate. In an embodiment, there is disclosed a system for backlighting an LCD screen, the system comprising an opto-electronic package and a light guide. A method of manufacturing an opto-electronic package is disclosed, the method comprising fabricating a substrate, attaching a plurality of light emitting diode (LED) dice to the base of the substrate within the cavity, and disposing at least one lens between the cavity-defining walls and entirely within the aperture of the elongate cavity.

Abstract: An apparatus having a light source, a reflector, and a light pipe is disclosed. The light source includes a plurality of LED dies arranged in an array along a first direction, each LED die emitting light in a second direction. The light pipe includes a layer of transparent material having a top surface, a bottom surface, and an edge surface. The reflector reflects light from the LED dies traveling in the second direction into the edge surface of the light pipe such that a portion of the light is reflected by the top and bottom surfaces of the reflector. In one embodiment, the reflector redirects light leaving the LED dies within a predetermined cone of angles about the first direction into the light pipe such that the light in that predetermined cone of angles is totally reflected by the top surface of the light pipe.

Abstract: In one embodiment, a light emitting panel includes a base panel and a plurality of light emitting elements mounted to the base panel. Each of the light emitting elements produces an illumination pattern having a region of substantially uniform intensity that extends over a radiation angle of at least about 60°. One or more light conditioners are positioned adjacent the base panel to receive and condition light produced by the light emitting elements.

Abstract: There is disclosed a system and method for increasing heat dissipation of LED displays by using the current PCB packaging mounted to a LCD panel support structure thereby eliminating the need for a metal core PCB. In one embodiment, reverse mounted LEDs having heat dissipation pads are used to optimize heat transfer to a metal layer which is then placed in contact with the LCD support structure.