Patents by Inventor SIEW WEN LEE

SIEW WEN LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for bonding a plurality of dies to a carrier panel
    Patent number: 12183620
    Abstract: A die bonding apparatus having: a carrier support unit having at least one support element defining a supporting plane and a carrier holder operable to support the carrier panel on a side of the supporting plane with the carrier panel being parallel to the supporting plane, a wafer feed unit having a wafer holder operable to hold a diced wafer in a manner so as to space the diced wafer apart from the supporting plane defined by the at least one support element of the carrier support unit and orient the diced wafer with an exposed surface of the diced wafer facing the side of the supporting plane to which the carrier panel is supported, and a die transfer module disposed between the carrier support unit and the wafer feed unit, the die transfer module operable to transfer a die from the diced wafer to the carrier panel.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: December 31, 2024
    Assignee: PYXIS CF PTE. LTD.
    Inventors: Hwee Seng Chew, Amlan Sen, Li Jiang Huang, Siew Wen Lee, Qing Feng Guan, Wai Hoe Lee, Kin Fei Chooi
  • APPARATUS AND METHOD FOR BONDING A PLURALITY OF DIES TO A CARRIER PANEL
    Publication number: 20220102189
    Abstract: A die bonding apparatus having: a carrier support unit having at least one support element defining a supporting plane and a carrier holder operable to support the carrier panel on a side of the supporting plane with the carrier panel being parallel to the supporting plane, a wafer feed unit having a wafer holder operable to hold a diced wafer in a manner so as to space the diced wafer apart from the supporting plane defined by the at least one support element of the carrier support unit and orient the diced wafer with an exposed surface of the diced wafer facing the side of the supporting plane to which the carrier panel is supported, and a die transfer module disposed between the carrier support unit and the wafer feed unit, the die transfer module operable to transfer a die from the diced wafer to the carrier panel.
    Type: Application
    Filed: September 28, 2021
    Publication date: March 31, 2022
    Inventors: HWEE SENG CHEW, AMLAN SEN, LI JIANG HUANG, SIEW WEN LEE, QING FENG GUAN, WAI HOE LEE, KIN FEI CHOOI