Patents by Inventor Siew Yong Leong

Siew Yong Leong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuits with overlay marks and methods of manufacturing the same
    Patent number: 9646934
    Abstract: Integrated circuits and methods for manufacturing the same are provided. An integrated circuit includes a base dielectric layer, a first dielectric layer overlying the base dielectric layer, and a second dielectric layer overlying the first dielectric layer. A first overlay mark is positioned within the first dielectric layer, and a second overlay mark is positioned within the second dielectric layer, where the second overlay mark is offset from the first overlay mark. First and second blocks are positioned within the base dielectric layer, where the first overlay mark directly overlays the first block and the second overlay mark directly overlays the second block.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: May 9, 2017
    Assignee: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Shijie Wang, Yong Feng Fu, Siew Yong Leong, Lei Wang, Alex See
  • INTEGRATED CIRCUITS WITH OVERLAY MARKS AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20160351507
    Abstract: Integrated circuits and methods for manufacturing the same are provided. An integrated circuit includes a base dielectric layer, a first dielectric layer overlying the base dielectric layer, and a second dielectric layer overlying the first dielectric layer. A first overlay mark is positioned within the first dielectric layer, and a second overlay mark is positioned within the second dielectric layer, where the second overlay mark is offset from the first overlay mark. First and second blocks are positioned within the base dielectric layer, where the first overlay mark directly overlays the first block and the second overlay mark directly overlays the second block.
    Type: Application
    Filed: May 26, 2015
    Publication date: December 1, 2016
    Inventors: Shijie Wang, Yong Feng Fu, Siew Yong Leong, Lei Wang, Alex See