Patents by Inventor Sieyo Nakashima

Sieyo Nakashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate processing apparatus, method of manufacturing semiconductor device, and heating apparatus
    Publication number: 20080153314
    Abstract: An object of the present invention is to improve substrate processing efficiency. A substrate processing apparatus has a reaction tube that processes a substrate inside, and a heating apparatus disposed so as to surround an external periphery of the reaction tube, so that at least a gas inlet tube is disposed on a side surface in an area in which the substrate is processed inside the reaction tube, and the heating apparatus has a heat insulator that surrounds the reaction tube, an inlet opening formed in the shape of a groove in the heat insulator from the lower end of the heating apparatus so as to avoid the gas inlet tube, and a heating element disposed between the heat insulator and the reaction tube.
    Type: Application
    Filed: November 30, 2007
    Publication date: June 26, 2008
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Akira Hayashida, Masaaki Ueno, Masakazu Shimada, Yukinori Aburatani, Tomoyuki Yamada, Sieyo Nakashima, Masashi Sugishita