Patents by Inventor Sigalit Robinzon

Sigalit Robinzon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10242290
    Abstract: Methods and systems are provided, which identify specified metrology target abnormalities using selected metrics and classify the identified target abnormalities geometrically to link them to corresponding sources of error. Identification may be carried out by deriving target signals such as kernels from specified regions of interest (ROIs) from corresponding targets on a wafer, calculating the metrics from the target signals using respective functions and analyzing the metrics to characterize the targets.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: March 26, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Inna Tarshish-Shapir, Yoel Feler, Anat Marchelli, Berta Dinu, Vladimir Levinski, Boris Efraty, Nuriel Amir, Mark Ghinovker, Amnon Manassen, Sigalit Robinzon
  • Publication number: 20140136137
    Abstract: Methods and systems are provided, which identify specified metrology target abnormalities using selected metrics and classify the identified target abnormalities geometrically to link them to corresponding sources of error. Identification may be carried out by deriving target signals such as kernels from specified regions of interest (ROIs) from corresponding targets on a wafer, calculating the metrics from the target signals using respective functions and analyzing the metrics to characterize the targets.
    Type: Application
    Filed: January 10, 2014
    Publication date: May 15, 2014
    Applicant: KLA-Tencor Corporation
    Inventors: Inna Tarshish-Shapir, Yoel Feler, Anat Marchelli, Berta Dinu, Vladimir Levinski, Boris Efraty, Nuriel Amir, Mark Ghinovker, Amnon Manassen, Sigalit Robinzon
  • Patent number: 7077304
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: July 18, 2006
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Benjamin Sonnenreich, Sigalit Robinzon
  • Publication number: 20050077339
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
    Type: Application
    Filed: December 3, 2004
    Publication date: April 14, 2005
    Inventors: Benjamin Sonnenreich, Sigalit Robinzon
  • Publication number: 20040164129
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
    Type: Application
    Filed: February 25, 2004
    Publication date: August 26, 2004
    Inventors: Benjamin Sonnenreich, Sigalit Robinzon
  • Patent number: 6729527
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: May 4, 2004
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Benjamin Sonnenreich, Sigalit Robinzon
  • Publication number: 20020100790
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
    Type: Application
    Filed: January 30, 2001
    Publication date: August 1, 2002
    Inventors: Benjamin Sonnenreich, Sigalit Robinzon