Patents by Inventor Sigeki Sekine

Sigeki Sekine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having thermal stress resistance structure
    Patent number: 5621243
    Abstract: A high reliability electric power control semiconductor device with a prolonged product lifetime has been provided by successfully suppressing the metal support plate or the metal heat dissipation plate from warping due to the thermal stress during bonding so as to prevent the occurrences of cracks and gaps in the brazing fillers in the bonded layers between the metal heat dissipation plate or the metal support plate and the insulation plate in the semiconductor device comprising the semiconductor elements, metal heat dissipation plate, thermal stress buffer, insulation plate, and the metal support plate, wherein at least one of the metal heat dissipation plate and the metal support plate comprises a copper alloy of which a softening temperature at which a hot hardness of which becomes 1/2 of the hardness at the room temperature is 350.degree. C. or more.
    Type: Grant
    Filed: December 23, 1994
    Date of Patent: April 15, 1997
    Assignees: Hitachi, Ltd., Hitachi Haramachi Electronics Co., Ltd.
    Inventors: Noboru Baba, Hisanori Okamura, Masahiko Sakamoto, Hirosi Akiyama, Ryuichi Saito, Yoshihiko Koike, Makoto Kitano, Sigeki Sekine, Hideya Kokubun, Nobuya Koike
  • Semiconductor module with an improved heat sink/insulation plate arrangement
    Patent number: 5585672
    Abstract: A semiconductor module having heat sink plates and an insulating plate laminated under the semiconductor chips, wherein the thickness of the support base plate is set to be 2.5 times in thickness of the insulating plate, which is the maximum thickness among the heat sink plates and the insulating plate laminated in the semiconductor module, so that the thermal fatigue lives of the solder layers are balanced, and the life of the whole semiconductor module can be prolonged.
    Type: Grant
    Filed: May 18, 1995
    Date of Patent: December 17, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Yoshihiko Koike, Ryuichi Saito, Sigeki Sekine, Yuuji Wakisawa
  • Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement
    Patent number: 5446318
    Abstract: A semiconductor module having heat sink plates and an insulating plate laminated under the semiconductor chips, wherein the thickness of the support base plate is set to be 2.5 times in thickness of the insulating plate, which is the maximum thickness among the heat sink plates and the insulating plate laminated in the semiconductor module, so that the thermal fatigue lives of the solder layers are balanced, and the life of the whole semiconductor module can be prolonged.
    Type: Grant
    Filed: September 1, 1993
    Date of Patent: August 29, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Yoshihiko Koike, Ryuichi Saito, Sigeki Sekine, Yuuji Wakisawa