Patents by Inventor Sigeng Yang

Sigeng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220163741
    Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly and a claw assembly. The lens assembly includes a lens base and a connecting part. The lens base covers the at least one of the light-transmitting chip or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The connecting part includes at least one positioning slot disposed on a surface of the connecting part facing away from the lens base. The claw assembly includes a claw and a through hole. The claw includes at least one positioning protrusion disposed on a surface of the claw facing the connecting part. The through hole is configured to be connected to an optical fiber outside the optical module.
    Type: Application
    Filed: February 14, 2022
    Publication date: May 26, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Wei CUI, Baofeng SI, Xuxia LIU, Hongchao PAN, Qian SHAO, Sigeng YANG, Peng HE, Chengshuang LUO, Fenglai WANG
  • Publication number: 20220099902
    Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly, an optical fiber ferrule assembly and a fixing plate. The circuit board is disposed in the shell. The light-transmitting chip and/or the light-receiving chip is disposed on the circuit board. The lens assembly is disposed on the circuit board, covers the light-transmitting chip and/or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The optical fiber ferrule assembly is connected to the lens assembly, and is configured to transmit an optical signal incident into the optical fiber ferrule assembly. The fixing plate is configured to fix the optical fiber ferrule assembly to the lens assembly.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 31, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Wei CUI, Xuxia LIU, Baofeng SI, Xiaolei MA, Sigeng YANG
  • Publication number: 20220019031
    Abstract: An optical module includes a shell, a circuit board, a light-emitting chip, a lens assembly, an optical fiber ferrule assembly and a fastener. The fastener fixes the optical fiber ferrule assembly to the lens assembly. The fastener includes a fastening body, a first clamping portion and a second clamping portion. The first clamping portion is disposed at one end of the fastening body, and is clamped with the optical fiber ferrule assembly. The second clamping portion is disposed at the other end of the fastening body, and is clamped with the lens assembly.
    Type: Application
    Filed: September 30, 2021
    Publication date: January 20, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Fenglai WANG, Wei CUI, Xuejian LI, Yan ZHONG, Hongchao PAN, Sigeng YANG, Xuxia LIU
  • Publication number: 20220011510
    Abstract: An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. A connecting line of two or more of bonding positions of the plurality of bonding wires on the circuit board bonding pads is inclined with respect to a connecting line of centers of the circuit board bonding pads.
    Type: Application
    Filed: September 22, 2021
    Publication date: January 13, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Long ZHENG, Sigeng YANG
  • Publication number: 20220003944
    Abstract: An optical module includes a lens assembly and an optical fiber holder. The lens assembly includes a lens base, a first positioning column and a second positioning column. The optical fiber holder includes a first positioning hole and a second positioning hole. The first positioning hole is disposed on a second assembly surface and corresponds to a position of the first positioning column; the first positioning hole has an opening on the second assembly surface and an opening on a first side surface connected with the second assembly surface, and the two openings are connected. The second positioning hole is disposed on the second assembly surface and corresponds to a position of the second positioning column; the second positioning hole has an opening on the second assembly surface and has an opening on a second side surface connected with the second assembly surface, and the two openings are connected.
    Type: Application
    Filed: September 16, 2021
    Publication date: January 6, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Sigeng YANG, Shenzhen FU, Xuxia LIU
  • Publication number: 20210356683
    Abstract: An optical module includes a shell, a circuit board, a light source, and a silicon optical chip. The circuit board is located in the shell, a hollow portion is provided in the circuit board, and the hollow portion penetrates the circuit board. The light source includes at least one laser assembly, and the at least one laser assembly is mounted on the shell and is located in the hollow portion, and the at least one laser assembly is electrically connected to the circuit board. The silicon optical chip is mounted on the shell and is located in the hollow portion. The silicon optical chip is electrically connected to the circuit board and is connected to the light source.
    Type: Application
    Filed: June 30, 2021
    Publication date: November 18, 2021
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Long ZHENG, Sigeng YANG
  • Publication number: 20210325617
    Abstract: An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 21, 2021
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Long ZHENG, Sigeng YANG
  • Patent number: 10624203
    Abstract: The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: April 14, 2020
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense USA Corporation, Hisense International Co., Ltd.
    Inventors: Sigeng Yang, Shijian Ben, Jingsheng Xia, Yongliang Huang
  • Patent number: 10465894
    Abstract: An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing, two or more circuit board layers, and a light emitting chip. The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: November 5, 2019
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventors: Peng He, Haiqiang Xu, Sigeng Yang, Shuai Zhang
  • Patent number: 10459180
    Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: October 29, 2019
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES, LTD.
    Inventors: Sigeng Yang, Yinlong Liu, Yongliang Huang, Shijian Ben, Jingsheng Xia, Peng He, Haiqiang Xu, Shengwei Bo, Tengyue Li
  • Publication number: 20180314018
    Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.
    Type: Application
    Filed: April 24, 2018
    Publication date: November 1, 2018
    Inventors: SIGENG YANG, YINLONG LIU, YONGLIANG HUANG, SHIJIAN BEN, JINGSHENG XIA, PENG HE, HAIQIANG XU, SHENGWEI BO, TENGYUE LI
  • Publication number: 20180317315
    Abstract: The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.
    Type: Application
    Filed: July 6, 2018
    Publication date: November 1, 2018
    Inventors: Sigeng YANG, Shijian BEN, Jingsheng XIA, Yongliang HUANG
  • Patent number: 9983373
    Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: May 29, 2018
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies Ltd.
    Inventors: Sigeng Yang, Yinlong Liu, Yongliang Huang, Shijian Ben, Jingsheng Xia, Peng He, Haiqiang Xu, Shengwei Bo, Tengyue Li
  • Publication number: 20170370569
    Abstract: An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing, two or more circuit board layers, and a light emitting chip. The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.
    Type: Application
    Filed: December 29, 2016
    Publication date: December 28, 2017
    Applicants: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventors: Peng He, Haiqiang Xu, Sigeng Yang, Shuai Zhang
  • Publication number: 20170363827
    Abstract: The disclosure provides an optical module, including a housing, a circuit board and a light conducting structure; a portion of the light conducting structure is disposed in the housing, another portion of the light conducting structure juts out from the housing; the circuit board is provided with a light source, and the light conducting structure is configured to conduct light emitted by the light source to an outside of the housing. The optical conducting module in the optical module can conduct light emitted from the optical module to outside of the optical module. The optical module allows the state inside the optical module to be conducted to and displayed in the outside of the optical module with optical signals as propagation medium. The state inside the optical module can be directly learned from the outside of the optical module housing, thereby extending application scenarios of the optical module.
    Type: Application
    Filed: December 30, 2016
    Publication date: December 21, 2017
    Inventors: SIGENG YANG, YINLONG LIU, YONGLIANG HUANG, SHIJIAN BEN, JINGSHENG XIA, PENG HE, HAIQIANG XU, SHENGWEI BO, TENGYUE LI
  • Publication number: 20170208678
    Abstract: The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.
    Type: Application
    Filed: September 19, 2016
    Publication date: July 20, 2017
    Inventors: Sigeng YANG, Shijian BEN, Jingsheng XIA, Yongliang HUANG
  • Patent number: 9515738
    Abstract: The embodiments of this disclosure provide an optical module, which expands the network bandwidth, eases a problem on dynamic bandwidth allocation. The optical module comprises an optical transceiver assembly and a control circuit, wherein the optical transceiver assembly comprises a first optical emitter and a second optical emitter; the control circuit is configured to control the first optical emitter to generate an optical signal of a first waveband, and the first optical emitter is configured to emit the optical signal of the first waveband to a transmission optical fiber; or, the control circuit is configured to control the second optical emitter to generate an optical signal of a second waveband, and the second optical emitter is configured to emit the optical signal of the second waveband to the transmission optical fiber. This disclosure is applied to an optical module of a wavelength division multiplex passive optical network.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: December 6, 2016
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., HISENSE USA CORPORATION
    Inventors: Sigeng Yang, Qisheng Zhao, Ming Li, Lei Lu, Dengshan Xue, Shijian Ben, Hongping Yan
  • Patent number: 9473835
    Abstract: An optical module and an optical device applicable to the optical module, wherein the optical module includes a laser emission unit, a laser reception unit, a video detector and an optical assembly, the optical assembly including: a band-pass device F1 with a small-angle incidence filter sheet, wherein among optical signals transmitted to F1 via a common port of F1, the optical signal in a first optical wavelength band is passed by the small-angle incidence filter sheet and output to the video detector via the passing port thereof; and the optical signals in other bands are reflected by the small-angle incidence filter sheet and output via the reflection port thereof; a filter sheet F2 configured to pass the optical signal emitted by the laser emission unit to the reflection port of F1 and to reflect the optical signal, received by the laser reception unit, output via the reflection port of F1.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: October 18, 2016
    Assignees: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES, LTD., HISENSE USA CORPORATION, HISENSE INTERNATIONAL CO., LTD.
    Inventors: Qisheng Zhao, Qiang Zhang, Dengshan Xue, Songlin Zhu, Yong Guo, Yongjia Yin, Sigeng Yang
  • Publication number: 20160142145
    Abstract: The embodiments of this disclosure provide an optical module, which expands the network bandwidth, eases a problem on dynamic bandwidth allocation. The optical module comprises an optical transceiver assembly and a control circuit, wherein the optical transceiver assembly comprises a first optical emitter and a second optical emitter; the control circuit is configured to control the first optical emitter to generate an optical signal of a first waveband, and the first optical emitter is configured to emit the optical signal of the first waveband to a transmission optical fiber; or, the control circuit is configured to control the second optical emitter to generate an optical signal of a second waveband, and the second optical emitter is configured to emit the optical signal of the second waveband to the transmission optical fiber. This disclosure is applied to an optical module of a wavelength division multiplex passive optical network.
    Type: Application
    Filed: March 31, 2014
    Publication date: May 19, 2016
    Applicants: Hisense USA Corporation, Hisense Broadband MultiMedia Technologies Co., Ltd.
    Inventors: Sigeng YANG, Qisheng ZHAO, Ming LI, Lei LU, Dengshan XUE, Shijian BEN, Hongping YAN
  • Publication number: 20150350754
    Abstract: An optical module and an optical device applicable to the optical module, wherein the optical module includes a laser emission unit, a laser reception unit, a video detector and an optical assembly, the optical assembly including: a band-pass device F1 with a small-angle incidence filter sheet, wherein among optical signals transmitted to F1 via a common port of F1, the optical signal in a first optical wavelength band is passed by the small-angle incidence filter sheet and output to the video detector via the passing port thereof; and the optical signals in other bands are reflected by the small-angle incidence filter sheet and output via the reflection port thereof; a filter sheet F2 configured to pass the optical signal emitted by the laser emission unit to the reflection port of F1 and to reflect the optical signal, received by the laser reception unit, output via the reflection port of F1.
    Type: Application
    Filed: November 20, 2012
    Publication date: December 3, 2015
    Inventors: Qisheng Zhao, Qiang Zhang, Dengshan Xue, Songlin Zhu, Yong Guo, Yongja Yin, Sigeng Yang