Abstract: An optical module including a circuit board, a circuit adapter board disposed on and electrically connected to the circuit board, a silicon optical chip disposed on and electrically connected to the circuit adapter board, an optical fiber socket optically connected to the silicon optical chip through a first optical fiber ribbon, and a light source disposed on and electrically connected to the circuit board and optically connected to the silicon optical chip through a second optical fiber ribbon; wherein a thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board, the silicon optical chip is provided with optical waveguide end facet on a side thereof configured to be butted with the first optical fiber ribbon and the second optical fiber ribbon, and the circuit adapter board has a notch on a side thereof proximate to the optical waveguide end facets.

Abstract: This optical module provided by the present disclosure includes an optical component, an optical fiber adapter, an optical cable plug, an anti-unlocking component and an unlocking component. The optical cable plug includes a base and a sleeve. The base is inserted into the optical fiber adapter, and a limiting groove is formed on it; the sleeve is slidably sleeved on the base; the optical cable plug and the optical fiber adapter can be locked or disassembled by moving the sleeve. The anti-unlocking component is arranged on the optical cable plug and is formed therein with a locking mechanism, and the locking mechanism is embedded in the limiting groove to lock and limit the sleeve.

Abstract: An optical module including an optical waveguide substrate, a turning prism, an optical reception chip, a laser chip, a reflector and a displacement prism. The optical waveguide substrate is provided, at different sides thereof, with input optical ports and output optical ports to transmit optical reception and emission signals. The laser chip is arranged in a layer different from that of the optical waveguide substrate, so as to guide an optical emission signal from the laser chip into one input optical port. The reflector is arranged in an output optical path of the laser chip to reflect the optical emission signal from the laser chip. A light input end of the displacement prism faces the layer where the laser chip is located, a light output end thereof faces one input optical port to guide the optical emission signal reflected by the reflector into the optical waveguide substrate.

Abstract: An optical module includes a circuit board and a lens assembly. A light monitoring chip and a light emitting chip are arranged on the circuit board and covered by the lens assembly covers. The lens assembly is provided with: a first bevel forming a first preset angle for receiving a light signal emitted by the light emitting chip and splitting the light signal into a first split light and a second split light; a second bevel forming a second preset angle; a third bevel forming a third preset angle; a fourth bevel forming a fourth preset angle. The first split light may change its transmission direction of via cooperation of the first, second and the first preset angle, and is transmitted to a first optical fiber array. The second split light is transmitted to the light monitoring chip via cooperation of the fourth and first preset angle.

Abstract: This disclosure provides an optical module including a lens assembly and an optical fiber holder. One end of the lens assembly is provided with a wrapping cavity, in which a second lens is disposed. An optical fiber is inserted in the optical fiber holder, with a gap formed between a fiber end-face of the optical fiber and the second lens. The fiber end-face of the optical fiber and a first end face of the optical fiber holder are inclined surfaces. The wrapping cavity includes a stop protrusion. A surface of the stop protrusion facing towards the optical fiber holder is an inclined stop surface, which is in contact with the first end face. The stop surface and the first end face of the optical fiber holder are inclined surfaces, achieving connection between the optical fiber holder and the lens assembly along a length direction of the lens assembly.

Abstract: An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. The plurality of bonding wires have different heights, with an angle formed between bonding wires with different heights.

Abstract: An optical module includes a shell, a circuit board, a light source, and a silicon optical chip. The circuit board is located in the shell, a hollow portion is provided in the circuit board, and the hollow portion penetrates the circuit board. The light source includes at least one laser assembly, and the at least one laser assembly is mounted on the shell and is located in the hollow portion, and the at least one laser assembly is electrically connected to the circuit board. The silicon optical chip is mounted on the shell and is located in the hollow portion. The silicon optical chip is electrically connected to the circuit board and is connected to the light source.

Abstract: An optical module includes a circuit board, a light transmit-receive device and a data processor. The light transmit-receive device includes a first laser array, a first detector array and a first lens assembly. The first laser array is disposed on the circuit board, and is configured to emit a plurality of channels of optical signals driven by the plurality of channels of low-speed electrical signals. The first detector array is disposed on the circuit board, and is configured to receive the plurality of channels of optical signals from outside of the optical module, and convert the plurality of channels of optical signals into a plurality of channels of electrical signals. The first lens assembly covers the first laser array and the first detector array, and is configured to change a propagation direction of optical signals incident into inside of the first lens assembly.

Abstract: An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. A connecting line of two or more of bonding positions of the plurality of bonding wires on the circuit board bonding pads is inclined with respect to a connecting line of centers of the circuit board bonding pads.

Abstract: An optical module includes a shell, a circuit board, a light-emitting chip, a lens assembly, an optical fiber ferrule assembly and a fastener. The fastener fixes the optical fiber ferrule assembly to the lens assembly. The fastener includes a fastening body, a first clamping portion and a second clamping portion. The first clamping portion is disposed at one end of the fastening body, and is clamped with the optical fiber ferrule assembly. The second clamping portion is disposed at the other end of the fastening body, and is clamped with the lens assembly.

Abstract: An optical module includes a circuit board, a light emitting device and a data processor. The data processor is disposed on the circuit board. The data processor includes a reverse gearbox and a gearbox. The reverse gearbox is connected to the light emitting device, and is configured to receive a high-speed electrical signal from the circuit board, and decode the high-speed electrical signal into a plurality of channels of low-speed electrical signals. The plurality of channels of low-speed electrical signals drive the light emitting device to emit the plurality of channels of optical signals. The gearbox is connected to the light receiving device, and is configured to receive a plurality of channels of low-speed electrical signals output by the light receiving device, encode the plurality of channels of low-speed electrical signals into a high-speed electrical signal, and transmit the high-speed electrical signal to the circuit board.

Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly, an optical fiber ferrule assembly and a fixing plate. The circuit board is disposed in the shell. The light-transmitting chip and/or the light-receiving chip is disposed on the circuit board. The lens assembly is disposed on the circuit board, covers the light-transmitting chip and/or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The optical fiber ferrule assembly is connected to the lens assembly, and is configured to transmit an optical signal incident into the optical fiber ferrule assembly. The fixing plate is configured to fix the optical fiber ferrule assembly to the lens assembly.

Abstract: An optical module including a circuit board, a circuit adapter board disposed on and electrically connected to the circuit board, a silicon optical chip disposed on and electrically connected to the circuit adapter board, an optical fiber socket optically connected to the silicon optical chip through a first optical fiber ribbon, and a light source disposed on and electrically connected to the circuit board and optically connected to the silicon optical chip through a second optical fiber ribbon; wherein a thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board, the silicon optical chip is provided with optical waveguide end facet on a side thereof configured to be butted with the first optical fiber ribbon and the second optical fiber ribbon, and the circuit adapter board has a notch on a side thereof proximate to the optical waveguide end facets.

Abstract: An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.

Abstract: An optical module includes a lens assembly and an optical fiber holder. The lens assembly includes a lens base, a first positioning column and a second positioning column. The optical fiber holder includes a first positioning hole and a second positioning hole. The first positioning hole is disposed on a second assembly surface and corresponds to a position of the first positioning column; the first positioning hole has an opening on the second assembly surface and an opening on a first side surface connected with the second assembly surface, and the two openings are connected. The second positioning hole is disposed on the second assembly surface and corresponds to a position of the second positioning column; the second positioning hole has an opening on the second assembly surface and has an opening on a second side surface connected with the second assembly surface, and the two openings are connected.

Abstract: An optical module includes a circuit board, a circuit sub-board, a signal processing chip, a first light transceiver assembly, and a second light transceiver assembly. The circuit board is configured to be electrically connected to an outside of the optical module. The circuit sub-board is disposed on the circuit board and electrically connected to the circuit board. The circuit sub-board includes a first body and a connecting hole. The connecting hole runs through an upper surface and a lower surface of the first body. The signal processing chip is disposed on the circuit sub-board. The first light transceiver assembly is disposed on the circuit board and located in the connecting hole. The second light transceiver assembly is disposed on the circuit board and located outside the connecting hole.

Abstract: An optical module includes a circuit board, a light transmit-receive device and a data processor. The light transmit-receive device includes a first laser array, a first detector array and a first lens assembly. The first laser array is disposed on the circuit board, and is configured to emit a plurality of channels of optical signals driven by the plurality of channels of low-speed electrical signals. The first detector array is disposed on the circuit board, and is configured to receive the plurality of channels of optical signals from outside of the optical module, and convert the plurality of channels of optical signals into a plurality of channels of electrical signals. The first lens assembly covers the first laser array and the first detector array, and is configured to change a propagation direction of optical signals incident into inside of the first lens assembly.

Abstract: An optical module includes a circuit board, a light emitting device and a data processor. The data processor is disposed on the circuit board. The data processor includes a reverse gearbox and a gearbox. The reverse gearbox is connected to the light emitting device, and is configured to receive a high-speed electrical signal from the circuit board, and decode the high-speed electrical signal into a plurality of channels of low-speed electrical signals. The plurality of channels of low-speed electrical signals drive the light emitting device to emit the plurality of channels of optical signals. The gearbox is connected to the light receiving device, and is configured to receive a plurality of channels of low-speed electrical signals output by the light receiving device, encode the plurality of channels of low-speed electrical signals into a high-speed electrical signal, and transmit the high-speed electrical signal to the circuit board.

Abstract: An optical module includes a circuit board, an optical emission chip array, an optical receiver chip array, an optical fiber array, and a lens assembly. The lens assembly includes a body with a step provided at a bottom portion thereof, an emission lenses array, an optical fiber lenses array, and a receiving lenses array. The emission lenses array and the receiving lenses array are respectively arranged on two step surfaces of the step, such that focal points thereof respectively fall on an emission surface of the optical emission chip array and a light sensitive surface of the optical receiver chip array. A first groove for forming a first reflective surface and a second groove for arranging a light filter that refracts light towards the optical fiber lenses array or reflects light to the receiving lenses array are provided at a top portion of the body.

Abstract: An optical module includes a circuit board, a substrate, a laser assembly, and a silicon photonic chip. The silicon photonic chip is electrically connected to the circuit board through the substrate so as to ground the silicon photonic chip. The substrate includes a body, a first support step, and a second support step. The first support step is disposed at an end of the body. The second support step is disposed at another end of the body. The circuit board includes a first metal layer and a second metal layer. The first metal layer is disposed on a surface of the circuit board proximate to the first support step and is electrically connected to the first support step. The second metal layer is disposed on a surface of the circuit board proximate to the second support step and is electrically connected to the second support step.