Patents by Inventor Sigeru Takahashi

Sigeru Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallizing paste for silicon carbide sintered body and a semiconductor device including the same
    Patent number: 4769690
    Abstract: The metal powder composition for the metallizing paste is composed of not less than 90 wt % gold, 0.03-3.0 wt % cadmium, 0.1-2.0 wt % bismuth, 0.01-1.0 wt % copper, 0.01-2.0 wt % germanium and 0.01-1.0 wt % silicon.The metallized paste bonds both the silicon carbide sintered substrate and the silicon semiconductor element with a high bonding strength.
    Type: Grant
    Filed: April 24, 1986
    Date of Patent: September 6, 1988
    Assignee: Hitachi, Ltd.
    Inventors: Hideo Suzuki, Sigeru Takahashi, Shiro Iijima