Patents by Inventor Sigeyuki NAKANO

Sigeyuki NAKANO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High strength/highly conductive copper alloy plate material and manufacturing method therefor
    Patent number: 11753708
    Abstract: A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: September 12, 2023
    Assignee: Tanaka Kikinzoku Kogyo K.K.
    Inventors: Yusuke Saito, Takaomi Kishimoto, Sigeyuki Nakano
  • HIGH STRENGTH/HIGHLY CONDUCTIVE COPPER ALLOY PLATE MATERIAL AND MANUFACTURING METHOD THEREFOR
    Publication number: 20230110533
    Abstract: A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 13, 2023
    Inventors: Yusuke SAITO, Takaomi KISHIMOTO, Sigeyuki NAKANO
  • High strength/highly conductive copper alloy plate material and manufacturing method therefor
    Patent number: 11505857
    Abstract: A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: November 22, 2022
    Assignee: TANAKA KIKINZOKU KOGYO K. K.
    Inventors: Yusuke Saito, Takaomi Kishimoto, Sigeyuki Nakano
  • HIGH STRENGTH/HIGHLY CONDUCTIVE COPPER ALLOY PLATE MATERIAL AND MANUFACTURING METHOD THEREFOR
    Publication number: 20210285080
    Abstract: A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.
    Type: Application
    Filed: August 10, 2018
    Publication date: September 16, 2021
    Inventors: Yusuke SAITO, Takaomi KISHIMOTO, Sigeyuki NAKANO