Abstract: A milling device for milling an antenna structure out of the metal layer of a flexible product, while the product is being passed through a milling gap between a milling cutter and a die, using a light emitter to output a light strip that crosses through the milling gap in or transversely to a running direction of the product, wherein the light strip is dimensioned, and the milling cutter and the die are intended to be arranged, such that the milling cutter and the die shadow the light strip at the two longitudinal edges thereof, before a light receiver receives the light strip, and using the light receiver to output a signal that reproduces the width of the milling gap to a controller, and outputting an adjusting signal at least to an adjusting drive that influences the width of the milling gap between the milling cutter and the die.

Abstract: The device and method according to the invention are used to transfer an electronic ferromagnetic component from a carrier to a substrate using a magnetic assembly. The magnetic assembly is designed and arranged to aid in the correct positioning of the at least partly ferromagnetic electronic component on the substrate. The magnetic field generated by the magnetic assembly produces a magnetic force oriented from the carrier towards the substrate, said magnetic force aiding the transfer of the component from the carrier to the substrate such that a significantly increased positioning accuracy of the component is achieved compared to a transfer without said magnetic force.

Abstract: A milling device for milling an antenna structure out of the metal layer of a flexible product, while the product is being passed through a milling gap between a milling cutter and a die, using a light emitter to output a light strip that crosses through the milling gap in or transversely to a running direction of the product, wherein the light strip is dimensioned, and the milling cutter and the die are intended to be arranged, such that the milling cutter and the die shadow the light strip at the two longitudinal edges thereof, before a light receiver receives the light strip, and using the light receiver to output a signal that reproduces the width of the milling gap to a controller, and outputting an adjusting signal at least to an adjusting drive that influences the width of the milling gap between the milling cutter and the die.

Abstract: A method and an apparatus are provided for the equipping of an antenna structure, in particular an RFID antenna structure, with an electronic component, in particular with an RFID chip. The method includes: (a) applying an electronic component to an antenna structure which is formed on a carrier substrate and which is made from a sinterable material that is electrically conductive after its sintering, so that a contact surface is formed between a contact region of the antenna structure and a corresponding electrical contact of the component; and (b) heating the antenna structure in order to sinter the same, thereby causing formation of an adhesive-free mechanical and electrical connection between the contact region of the antenna structure and the electrical contact of the component. The method can also be used to equip the antenna structure with a plurality of electronic components.

Abstract: A method and a device for carrying out the method for transferring electronic components from a carrier substrate to a receiving substrate.

Abstract: A system for aligning an electronic component including a substrate having an aligning structure and an aligning device for aligning the electronic component with the aligning structure. The aligning structure defines a first and a second edge, which are at an angle relative to one another and are complementary to two sides of the electronic component to be aligned. The aligning device aligns the electronic component on the aligning structure by bringing sides of the electronic component into contact with both the first edge and also the second edge of the aligning structure. A dispensing unit dispensing the electronic component at a dispensing point by the device for aligning the electronic component close to the aligning structure. A receiving unit receives the electronic component aligned on the aligning structure in the device.

Abstract: The device and method according to the invention are used to transfer an electronic ferromagnetic component from a carrier to a substrate using a magnetic assembly. The magnetic assembly is designed and arranged to aid in the correct positioning of the at least partly ferromagnetic electronic component on the substrate. The magnetic field generated by the magnetic assembly produces a magnetic force oriented from the carrier towards the substrate, said magnetic force aiding the transfer of the component from the carrier to the substrate such that a significantly increased positioning accuracy of the component is achieved compared to a transfer without said magnetic force.

Abstract: The invention relates to a method and to a device designed for carrying out the method for transferring electronic components (K) from a carrier substrate (T) to a receiving substrate (A, Z).

Abstract: A system for aligning an electronic component including a substrate having an aligning structure and an aligning device for aligning the electronic component with the aligning structure. The aligning structure defines a first and a second edge, which are at an angle relative to one another and are complementary to two sides of the electronic component to be aligned. The aligning device aligns the electronic component on the aligning structure by bringing sides of the electronic component into contact with both the first edge and also the second edge of the aligning structure. A dispensing unit dispensing the electronic component at a dispensing point by the device for aligning the electronic component close to the aligning structure. A receiving unit receives the electronic component aligned on the aligning structure in the device.

Abstract: A device for transferring electronic components from a first carrier to a second carrier. A first receiving portion positions the first carrier on a support, wherein the electronic components are provided on a side of the first carrier, which faces away from the support. A second receiving portion positions the second carrier. The first receiving portion and the second receiving portion are arranged with respect to each other in such a manner that a gap separates the first carrier from the second carrier. A cap and/or the second receiving portion move from a first position into a second position to make the gap smaller. At least one slide lifts the first carrier, which is applied against the support, away from the support, and to move an electronic component provided on the first carrier, in the direction of the second carrier.

Abstract: A device for transferring electronic components from a first carrier to a second carrier. A first receiving portion positions the first carrier on a support, wherein the electronic components are provided on a side of the first carrier, which faces away from the support. A second receiving portion positions the second carrier. The first receiving portion and the second receiving portion are arranged with respect to each other in such a manner that a gap separates the first carrier from the second carrier. A cap and/or the second receiving portion move from a first position into a second position to make the gap smaller. At least one slide lifts the first carrier, which is applied against the support, away from the support, and to move an electronic component provided on the first carrier, in the direction of the second carrier.

Abstract: A device for inspecting and rotating electronic components, particularly flip chips, includes a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. Also a method for inspecting and rotating electronic components, particularly flip chips.

Abstract: The invention relates to a device and a method for applying semiconductor chips (5) to a plurality of carriers (4), especially smart card modules or flexboards. According to the invention, an adhesive application device (1) is used to apply an adhesive to pre-defined positions on the carrier (4), a fitting device (2) is used to apply the semiconductor chips (5) to the positions on the carrier (4), and a hardening device (3) is used to harden the adhesive. The hardening device (3) and/or another device can be connected to a conveyor belt (6) for transporting the carrier (4) along the devices, by means of a clamping device (13, 14), and can be displaced in the transport direction at the speed of the conveyor belt (6), by means of a lifting device (15).

Abstract: An apparatus and a method for arranging through-openings in a flexible, movable band, said through-openings being arranged in series in at least one row, wherein each through-opening is arranged in the bottom of one of a plurality of depressions for receiving electronic components, said depressions being arranged in series in at least one row, wherein a laser device with at least one laser beam is arranged so as to act on sides of bottoms of the depressions facing away from the depressions, wherein the laser device is designed in such a way that, by means of the at least one laser beam, the through-openings can be burned into a predefinable portion of the band at predefinable positions on the bottom sides, within a predefinable period of time.

Abstract: The invention relates to a method for moving to a predetermined position of a carrier tape 2 moving continuously in a displacement direction, wherein a displacement head 4 is moved to the predetermined position, wherein the displacement head 4 is moved to the predetermined position in the displacement direction at a speed which corresponds essentially to the displacement speed of the carrier tape 2; wherein a procedure is carried out at the predetermined position on the moving carrier tape 2 by means of the displacement head 4.

Abstract: The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. The invention relates to a method for inspecting and rotating electronic components, particularly flipchips.

Abstract: The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. The invention relates to a method for inspecting and rotating electronic components, particularly flipchips.

Abstract: The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. The invention relates to a method for inspecting and rotating electronic components, particularly flipchips.

Abstract: The invention relates to a device and a method for applying semiconductor chips (5) to a plurality of carriers (4), especially smart card modules or flexboards. According to the invention, an adhesive application device (1) is used to apply an adhesive to pre-defined positions on the carrier (4), a fitting device (2) is used to apply the semiconductor chips (5) to the positions on the carrier (4), and a hardening device (3) is used to harden the adhesive. The hardening device (3) and/or another device can be connected to a conveyor belt (6) for transporting the carrier (4) along the devices, by means of a clamping device (13, 14), and can be displaced in the transport direction at the speed of the conveyor belt (6), by means of a lifting device (15).