Patents by Inventor Sigurd Adler

Sigurd Adler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing multi-level metalization on a ceramic substrate
    Patent number: 10568214
    Abstract: A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or Al2O3. High power regions with metallization having a high current-carrying capacity and low power regions with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate. The metallization is printed multiple times in the high power range.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: February 18, 2020
    Assignee: CeramTec GmbH
    Inventors: Sigurd Adler, Roland Dilsch, Alfred Thimm
  • MULTI-LEVEL METALIZATION ON A CERAMIC SUBSTRATE
    Publication number: 20170290169
    Abstract: A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or Al2O3. High power regions with metallization having a high current-carrying capacity and low power regions with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate. The metallization is printed multiple times in the high power range.
    Type: Application
    Filed: June 20, 2017
    Publication date: October 5, 2017
    Inventors: Sigurd Adler, Roland Dilsch, Alfred Thimm
  • Coating device and method
    Patent number: 9488087
    Abstract: The invention relates to a novel assembly for coating substrates.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: November 8, 2016
    Assignee: UMICORE AG & CO. KG
    Inventors: Bernd Mergner, Wolfgang Hasselmann, Dieter Detterbeck, Sigurd Adler
  • MULTI-LEVEL METALIZATION ON A CERAMIC SUBSTRATE
    Publication number: 20150366075
    Abstract: The invention relates to a method for producing a copper multi-level metallization on a ceramic substrate (4) consisting of AIN or Al2O3. High power regions (1) with metallization having a high current-carrying capacity and low power regions (2) with metallic coatings having a low current-carrying capacity are created on one and the same ceramic substrate (4). According to the invention, the metallization is printed multiple times in the high power range.
    Type: Application
    Filed: February 5, 2014
    Publication date: December 17, 2015
    Inventors: Sigurd ADLER, Roland DILSCH, Alfred THIMM
  • EMBEDDED METAL STRUCTURES IN CERAMIC SUBSTRATES
    Publication number: 20140290985
    Abstract: The invention relates to a method for producing a substrate comprising embedded conductive metal structures or metallizations, in particular for use as printed circuit boards. The aim of the invention is to allow the buried metallization of three-dimensional, i.e. curved or angular, substrates in addition to the two-dimensional flat and level, i.e. plate-shaped, substrates. According to the invention, this is achieved in that trenches and/or recesses are dug into the substrate using laser technology, and the metal structures are then produced in the trenches and/or recesses.
    Type: Application
    Filed: November 16, 2012
    Publication date: October 2, 2014
    Inventors: Alexander Dohn, Klaus Herrmann, Alfred Thimm, Oskar Helgert, Roland Leneis, Sigurd Adler
  • COATING DEVICE AND METHOD
    Publication number: 20120315381
    Abstract: The invention relates to a novel assembly for coating substrates.
    Type: Application
    Filed: February 15, 2011
    Publication date: December 13, 2012
    Applicant: UMICORE AG & CO. KG
    Inventors: Bernd Mergner, Wolfgang Hasselmann, Dieter Detterbeck, Sigurd Adler