Abstract: The present invention provides a separator formed by hydrolysis of a resin film. The resin film comprises a non-hydrolyzable organic polymer; and a hydrolyzable organic polymer being hydrolyzable by treatment with at least one of an acid aqueous solution, an alkaline aqueous solution and pure water, wherein the content of the hydrolyzable organic polymer ranges from 10 parts by weight to 70 parts by weight relative to 100 parts by weight of the resin film. The separator of the present invention has good ion conductivity and thus, is extremely suitable for use in various types of batteries.

Abstract: A proton-conductive membrane includes a hydrophobic organic polymer and a hydrophilic proton-conductive component. The hydrophilic proton-conductive component includes one of an urea-containing material and a complex formed from an acidic substance and a basic substance, and a combination thereof. The hydrophilic proton-conductive component is present in an amount ranging from 23 parts by weight to 70 parts by weight based on 100 parts by weight of the proton-conductive membrane.

Abstract: A flexible sealing structure is provided. The flexible sealing structure includes a flexible sealing member and a membrane electrode assembly. The flexible sealing member includes a first flexible sealing film and a second flexible sealing film, and a hollow region is formed in a center of the flexible sealing member. The membrane electrode assembly is located between the first flexible sealing film and the second flexible sealing film. A side surface of the membrane electrode assembly is even. The membrane electrode assembly has a first surface and a second surface. The hollow region of the flexible sealing member exposes a portion of the first surface and a portion of the second surface of the membrane electrode assembly.

Abstract: The invention provides a flexible sealing film. The flexible sealing film includes a polymer layer and a thermosetting resin layer. The thermosetting layer is arranged on a surface of the polymer layer, and includes: (a) 100 parts by weight of epoxy resin, (b) 50 parts by weight to 100 parts by weight of a phosphorous flame retardant, (c) 20 parts by weight to 50 parts by weight of a toughening agent, (d) 0.1 parts by weight to 2.0 parts by weight of a phosphine compound, (e) 2 parts by weight to 12 parts by weight of silicon dioxide, and (f) 1 part by weight to 10 parts by weight of an ion exchanger. The invention further provides a flexible sealing film and a flexible sealing structure.

Abstract: An adhesive composition with high frequency characteristics and the application thereof; wherein, the adhesive composition has a total weight of (A), (B) and (C) in 100 parts by weight, comprising: (A) 40-80 parts by weight of solvent-soluble polyimide; (B) 5-30 parts by weight of propenyl-modified polyphenylene oxide resin; (C) 10-30 parts by weight of epoxy resin; and optionally comprising at least one of the following components: (D) flexibilizer; (E) flame retardant; (F) inorganic filler; (G) coupling agent; and (H) catalyst. The adhesive composition has the advantages of low dielectric constant, low dielectric loss, favorable heat resistance and low-temperature (<180° C.) adhesion. The adhesive composition can be used for preparing high-frequency protective membrane and high-frequency adhesive film.

Abstract: An adhesive composition with high frequency characteristics and the application thereof; wherein, the adhesive composition has a total weight of (A), (B) and (C) in 100 parts by weight, comprising: (A) 40-80 parts by weight of solvent-soluble polyimide; (B) 5-30 parts by weight of propenyl-modified polyphenylene oxide resin; (C) 10-30 parts by weight of epoxy resin; and optionally comprising at least one of the following components: (D) flexibilizer; (E) flame retardant; (F) inorganic filler; (G) coupling agent; and (H) catalyst. The adhesive composition has the advantages of low dielectric constant, low dielectric loss, favorable heat resistance and low-temperature (<180° C.) adhesion. The adhesive composition can be used for preparing high-frequency protective membrane and high-frequency adhesive film.

Abstract: A metal laminate comprising a metal layer and an insulating layer is provided. The insulating layer is disposed on the metal layer and directly contacts the metal layer. The insulating layer is made of a polyimide resin, and the polyimide resin is derived from at least two dianhydrides and at least two diamines. The dianhydride monomers are selected from the group consisting of p-phenylenebis (trimellitate anhydride), 4,4?-(hexafluoroisopropylidene)-diphthalic anhydride, 4,4?-(4,4?-isopropylidenediphenoxy)bis(phthalic anhydride) and the combination thereof. One of the diamine monomers is 2,2?-bis(trifluoromethyl)benzidine, and the other diamine monomers are selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl, 1,3-bis(4-aminophenoxy)benzene, p-phenylenediamine, 4,4?-oxydianiline, 4,4?-methylenedianiline, 4,4?-diaminobenzanilide, 4,4?-diaminodiphenyl-sulfone, m-tolidine, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane and the combination thereof.

Abstract: A metal laminate comprising a metal layer and an insulating layer is provided. The insulating layer is disposed on the metal layer and directly contacts the metal layer. The insulating layer is made of a polyimide resin, and the polyimide resin is derived from at least two dianhydrides and at least two diamines. The dianhydride monomers are selected from the group consisting of p-phenylenebis (trimellitate anhydride), 4,4?-(hexafluoroisopropylidene)-diphthalic anhydride, 4,4?-(4,4?-isopropylidenediphenoxy)bis(phthalic anhydride) and the combination thereof. One of the diamine monomers is 2,2?-bis(trifluoromethyl)benzidine, and the other diamine monomers are selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl, 1,3-bis(4-aminophenoxy)benzene, p-phenylenediamine, 4,4?-oxydianiline, 4,4?-methylenedianiline, 4,4?-diaminobenzanilide, 4,4?-diaminodiphenyl-sulfone, m-tolidine, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane and the combination thereof.

Abstract: A polyimide resin derived from at least two dianhydrides and at least two diamines is provided. The dianhyride is selected from a group consisting of p-phenylenebis(trimellitate anhydride), 4,4?-(hexafluoroisopropylidene)-diphthalic anhydride, and 4,4?-(4,4?-isopropylidenediphenoxy)bis(phthalic anhydride). One of the diamine monomers is 2,2?-bis(trifluoromethyl)benzidine, and the other diamine monomers are selected from a group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl, 1,3-bis(4-aminophenoxy)benzene, p-phenylenediamine, 4,4?-oxydianiline, 4,4?-methylenedianiline, 4,4?-diaminobenzanilide, 4,4?-diaminodiphenyl-sulfone, m-tolidine, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane and the combination thereof. The molar ratio of the dianhydrides to the diamines is between 0.85 and 1.15.