Patents by Inventor Sih-Ling Yeh

Sih-Ling Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240408650
    Abstract: A chemical mechanical polishing system includes a first polishing station including a first platen to support a first polishing pad, a transfer station to receive a substrate from a robot, a carrier head movable on a predetermined path from the polishing station to the transfer station, a gas flow regulator having an input for a carrier gas, a liquid flow regulator having an input for a cleaning liquid, and a fluid jet cleaner at a position along the predetermined path. The fluid jet cleaner includes an atomizer nozzle including an input port coupled to the gas flow regulator, an injection port coupled to the liquid flow regulator, and an output port positioned to spray the cleaning liquid entrained in the carrier gas onto the substrate held by the carrier head when the carrier head is located above the fluid jet cleaner.
    Type: Application
    Filed: June 6, 2023
    Publication date: December 12, 2024
    Inventors: Haosheng Wu, Shou-Sung Chang, Hui Chen, Chih Chung Chou, Sih-Ling Yeh, Emily Drauss, Elton Zhong, Chad Pollard, Songling Shin, Jianshe Tang, Jeonghoon Oh
  • Publication number: 20240342855
    Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, a motor to generate relative motion, a steam generator, and an arm extending over the platen with and at least one opening to deliver steam from the steam generator onto the polishing pad. The steam generator includes a canister, a barrier in the canister dividing the canister into a lower chamber having a water inlet and an upper chamber having a steam outlet, a heating element configured to apply heat to a portion of lower chamber, and a nucleation surface positioned in the lower chamber. The barrier has apertures for steam to pass from the lower chamber to the upper chamber and allows for condensation to pass from the upper chamber to the lower chamber.
    Type: Application
    Filed: April 10, 2024
    Publication date: October 17, 2024
    Inventors: Chad Pollard, Sih-Ling Yeh, Jonathan P. Domin, Shou-Sung Chang, Haosheng Wu, Jeonghoon Oh, Jianshe Tang
  • Publication number: 20240042570
    Abstract: A chemical mechanical polishing apparatus has a heating system, a purge gas source, a purge liquid source, and a controller. The heating system includes a source of heated gas, an arm extending over a platen, and a manifold in the arm with an a plurality of openings positioned over the platen and separated from a polishing pad for delivering the heated gas onto the polishing pad. The controller is configured to cause the heated gas to flow from the source of heated gas through the manifold and the plurality of openings to heat the polishing pad during a polishing operation, and to cause the apparatus to perform a purging operation which alternates between flowing purge gas from the purge gas source and flowing purge liquid from the purge liquid source through the manifold and the plurality of openings.
    Type: Application
    Filed: July 25, 2023
    Publication date: February 8, 2024
    Inventors: Haosheng Wu, Shou-Sung Chang, Jianshe Tang, Jonathan P. Domin, Shuchivrat Datar, Yasuhiro Hori, Sameer Deshpande, Chad Pollard, Sih-Ling Yeh, Priscilla Diep, Ningzhuo Cui, Brian J. Brown, Hui Chen