Patents by Inventor Siho Choi

Siho Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11756867
    Abstract: A power module is disclosed. A power module according to an embodiment of the present disclosure may include a first substrate and a second substrate spaced apart from each other, an electronic device unit provided on at least either one of the first and second substrates, and a lead frame unit provided between the first and second substrates. One side of the lead frame unit may be connected to an external circuit, and the other side thereof may be configured to electrically connect the first and second substrates. Accordingly, the lead frame unit may perform a function of electrically connecting the first and second substrates instead of a via spacer in the related art.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: September 12, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Siho Choi, Seongmoo Cho, Oksun Yu, Kwangsoo Kim, Gun Lee
  • Patent number: 11735557
    Abstract: A power module according implementations of the present disclosure includes a bonding layer for bonding two adjacent members. The bonding layer is formed by melting, applying, and solidifying a bonding material that has excellent thermal conductivity and electrical conductivity. The melted bonding material includes a plurality of anti-tilting members. The two members bonded during the process of solidifying the melted bonding material are supported by the plurality of anti-tilting members. This may allow tilting caused during the formation of the bonding layer to be suppressed.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: August 22, 2023
    Assignee: LG MAGNA E-POWERTRAIN CO., LTD.
    Inventors: Siho Choi, Seongmoo Cho, Kwangsoo Kim, Gun Lee
  • Publication number: 20210337703
    Abstract: The present disclosure relates to a power module assembly, and may include a plurality of cooling fins on an upper cover covering an upper portion of a module housing and a lower cover covering a lower portion of the module housing to cool the power module received inside the module housing, and the plurality of cooling fins may constitute a cooling passage to allow coolant to flows into the module housing, and expand a heat exchange area of the power module, thereby improving the cooling performance of the power module.
    Type: Application
    Filed: September 30, 2020
    Publication date: October 28, 2021
    Inventors: Gun LEE, Seongmoo CHO, Kwangsoo KIM, Siho CHOI
  • Publication number: 20210329815
    Abstract: The present disclosure relates to an electric power module and an inverter apparatus having the same. The electric power module of the present disclosure may include a power device that converts the frequency of input power for output; a housing in which a passage of cooling fluid is disposed to accommodate the power device therein, and a cooling member, one side of which is in direct heat exchange with the power device, and the other side of which is in direct heat exchange with the cooling fluid, wherein the cooling member is made of a metal foam having a multi-porous structure. As a result, it may be possible to increase a heat transfer area of the heat conductor, and suppress the occurrence of pressure loss in the cooling fluid.
    Type: Application
    Filed: September 25, 2020
    Publication date: October 21, 2021
    Inventors: Kwangsoo KIM, Seongmoo CHO, Oksun YU, Hyunsi HWANG, Siho CHOI, Gun LEE
  • Publication number: 20210305193
    Abstract: A power module according implementations of the present disclosure includes a bonding layer for bonding two adjacent members. The bonding layer is formed by melting, applying, and solidifying a bonding material that has excellent thermal conductivity and electrical conductivity. The melted bonding material includes a plurality of anti-tilting members. The two members bonded during the process of solidifying the melted bonding material are supported by the plurality of anti-tilting members. This may allow tilting caused during the formation of the bonding layer to be suppressed.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 30, 2021
    Inventors: Siho CHOI, Seongmoo CHO, Kwangsoo KIM, Gun LEE
  • Publication number: 20210257280
    Abstract: A power module is disclosed. A power module according to an embodiment of the present disclosure may include a first substrate and a second substrate spaced apart from each other, an electronic device unit provided on at least either one of the first and second substrates, and a lead frame unit provided between the first and second substrates. One side of the lead frame unit may be connected to an external circuit, and the other side thereof may be configured to electrically connect the first and second substrates. Accordingly, the lead frame unit may perform a function of electrically connecting the first and second substrates instead of a via spacer in the related art.
    Type: Application
    Filed: September 30, 2020
    Publication date: August 19, 2021
    Inventors: Siho CHOI, Seongmoo Cho, Oksun Yu, Kwangsoo Kim, Gun Lee
  • Publication number: 20210243923
    Abstract: A power module assembly is disclosed. A power module assembly according to an embodiment includes a module housing part having a power module, and an upper cover part and a lower cover part disposed to cover upper and lower sides of the module housing part, respectively, and defining a flow path part, through which cooling water flows, in spaces apart from the module housing part. The module housing part exposes a part of the power module on the flow path part. With the configuration, the cooling water can flow in direct contact with the power module, thereby more improving heat dissipation performance of the power module assembly.
    Type: Application
    Filed: September 28, 2020
    Publication date: August 5, 2021
    Inventors: Hyunsi HWANG, Seongmoo CHO, Kwangsoo KIM, Siho CHOI, Gun LEE
  • Publication number: 20210210411
    Abstract: The present disclosure provides a power module including a substrate, an electronic element provided on the substrate, and a cooling fin portion provided on one surface of the substrate to form a flow path portion through which cooling water flows. The cooling fin portion is formed asymmetrically so that amounts of heat transferred by the cooling water acting on the electronic element are different. As a result, regions in which heat is directly transferred between cooling water and the electronic element can be increased and a pressure drop of cooling water flowing through the flow path portion can be prevented by the cooling fin portion forming an asymmetrical structure of the flow path portion. In addition, a heat dissipation performance of the power module by the cooling water can be further improved.
    Type: Application
    Filed: September 28, 2020
    Publication date: July 8, 2021
    Inventors: Seongmoo Cho, Kwangsoo Kim, Siho Choi, Gun Lee