Abstract: A microelectronic device comprises a stack structure, a memory pillar, and a boron-containing material. The stack structure comprises alternating conductive structures and dielectric structures. The memory pillar extends through the stack structure and defines memory cells at intersections of the memory pillar and the conductive structures. The boron-containing material is on at least a portion of the conductive structures of the stack structure. Related methods and electronic systems are also described.

Abstract: A method used in forming a memory array comprising strings of memory cells comprises forming memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers. Individual of the conductive tiers comprise laterally-outer edges comprising conductive molybdenum-containing metal material extending horizontally-along its memory block. Channel-material strings extend through the insulative tiers and the conductive tiers. At least one of conductive or semiconductive material is formed extending horizontally-along the memory blocks laterally-outward of the laterally-outer edges comprising the conductive molybdenum-containing metal material that extends horizontally-along its memory block. Insulator material extending horizontally-along the memory blocks is formed laterally-outward of the at least one of the conductive or the semiconductive material that is laterally-outward of the laterally-outer edges comprising the conductive molybdenum-containing metal material.

Abstract: Disclosed are an optical module unlocking device and an optical module. For the optical module unlocking device, a boss is arranged on a metal front end of a pull ring. The boss abuts against the skewed slot of an upper cover. The metal front end located in the upper cover can slide relatively along the limiting post of the upper cover and at least one boss is driven to slide into the skewed slot of the upper cover and then hide into the bottom of the skewed slot or abut against a bevel edge of the at least one skewed slot and then bulge. After the at least one boss abuts against the bevel edge of the at least one skewed slot and then bulges, a shielding cage spring strip which is about to be cooperated with the boss is opened by being pushed upwards, and the optical module can be unlocked. The reliability of the optical module unlocking device is high and the unlocking motion of the optical module is simple.

Abstract: Disclosed are an optical module unlocking device and an optical module. For the optical module unlocking device, a boss is arranged on a metal front end of a pull ring. The boss abuts against the skewed slot of an upper cover. The metal front end located in the upper cover can slide relatively along the limiting post of the upper cover and at least one boss is driven to slide into the skewed slot of the upper cover and then hide into the bottom of the skewed slot or abut against a bevel edge of the at least one skewed slot and then bulge. After the at least one boss abuts against the bevel edge of the at least one skewed slot and then bulges, a shielding cage spring strip which is about to be cooperated with the boss is opened by being pushed upwards, and the optical module can be unlocked. The reliability of the optical module unlocking device is high and the unlocking motion of the optical module is simple.