Patents by Inventor Sik Hin CHI

Sik Hin CHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for backside via reveal processing
    Patent number: 11289387
    Abstract: Methods and apparatus perform backside via reveal processes using a centralized control framework for multiple process tools. In some embodiments, a method for performing a backside via reveal process may include receiving process tool operational parameters from process tools involved in the backside via reveal process by a central controller, receiving sensor metrology data from at least one or more of the process tools involved in the backside via reveal process, and altering the backside reveal process based, at least in part, on the process tool operational parameters and the sensor metrology data by adjusting two or more of the process tools involved in the backside via reveal process. The profile parameters are configured to prevent backside via breakage during a chemical mechanical polishing (CMP) process.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: March 29, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Prayudi Lianto, Sik Hin Chi, Shih-Chao Hung, Pin Gian Gan, Ricardo Fujii Vinluan, Gaurav Mehta, Ramesh Chidambaram, Guan Huei See, Arvind Sundarrajan, Upendra V. Ummethala, Wei Hao Kew, Muhammad Adli Danish Bin Abdullah, Michael Charles Kutney, Mark McTaggart Wylie, Amulya Ligorio Athayde, Glen T. Mori
  • METHODS AND APPARATUS FOR BACKSIDE VIA REVEAL PROCESSING
    Publication number: 20220037216
    Abstract: Methods and apparatus perform backside via reveal processes using a centralized control framework for multiple process tools. In some embodiments, a method for performing a backside via reveal process may include receiving process tool operational parameters from process tools involved in the backside via reveal process by a central controller, receiving sensor metrology data from at least one or more of the process tools involved in the backside via reveal process, and altering the backside reveal process based, at least in part, on the process tool operational parameters and the sensor metrology data by adjusting two or more of the process tools involved in the backside via reveal process. The profile parameters are configured to prevent backside via breakage during a chemical mechanical polishing (CMP) process.
    Type: Application
    Filed: July 31, 2020
    Publication date: February 3, 2022
    Inventors: Prayudi LIANTO, Sik Hin CHI, Shih-Chao HUNG, Pin Gian GAN, Ricardo Fujii VINLUAN, Gaurav MEHTA, Ramesh CHIDAMBARAM, Guan Huei SEE, Arvind SUNDARRAJAN, Upendra V. UMMETHALA, Wei Hao KEW, Muhammad Adli Danish Bin ABDULLAH, Michael Charles KUTNEY, Mark McTaggart WYLIE, Amulya Ligorio ATHAYDE, Glen T. MORI