Abstract: A manufacturing technique includes creating stud bumps on the electrical contacts on a die, either in wafer or die form. A separate stencil or carrier is provided with cavities that correspond to the electrical contacts on the die. The cavities are filled with solder paste and the die is brought into close proximity with the stencil so that the stud bumps extend into the cavities and come into contact with the solder paste. When the die is removed, the solder paste stays affixed to the stud bumps and thereby the solder paste is transferred and delivered to the stud bumps. The die can then be affixed to a substrate such as a PCB.

Abstract: A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the clamping members being movable towards a respective base clamping surface to thereby clamp a lead frame of the die assembly. A die assembly support is disposed between the pair of opposing base walls and the die assembly support and pair of opposing base walls provide a cavity. There is a position sensor coupled to a controller and there is also a drive that is controllable by the controller. The drive provides movement of the die assembly support relative to each the base clamping surface to thereby adjust a depth of the cavity.

Abstract: A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the clamping members being movable towards a respective base clamping surface to thereby clamp a lead frame of the die assembly. A die assembly support is disposed between the pair of opposing base walls and the die assembly support and pair of opposing base walls provide a cavity. There is a position sensor coupled to a controller and there is also a drive that is controllable by the controller. The drive provides movement of the die assembly support relative to each the base clamping surface to thereby adjust a depth of the cavity.