Patents by Inventor Silam J. Choy
Silam J. Choy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11931738Abstract: An example method includes providing fluid to a chamber. The chamber feeds a first channel terminating at a first droplet ejector and a second channel terminating at a second droplet ejector. The method further includes sequencing ejection of droplets at the first droplet ejector and the second droplet ejector to induce negative pressure to provide a sequenced output flow of the fluid through the first channel to a first target microfluidic network and through the second channel to a second target microfluidic network, and controlling the first and second target microfluidic networks to perform an analytical process with the fluid.Type: GrantFiled: November 22, 2018Date of Patent: March 19, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: John Lahmann, Pavel Kornilovich, Silam J Choy
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Patent number: 11813610Abstract: A microfluidic device includes a microfluidic chamber fluidly coupled to an inlet port and an outlet port, a semiconductor microchip including fluid active circuitry and transistor circuitry, and a bed of solid supports positioned within the microfluidic chamber fluidly positioned between the inlet port and the outlet port. The transistor circuitry in this example provides onboard logic at the semiconductor microchip to control fluid active circuitry. The semiconductor microchip also defines a portion of the microfluidic chamber.Type: GrantFiled: May 15, 2019Date of Patent: November 14, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Silam J. Choy, Hilary Ely
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Patent number: 11541659Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.Type: GrantFiled: August 12, 2020Date of Patent: January 3, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Silam J Choy, Michael W Cumbie, Devin Alexander Mourey, Chien-Hua Chen
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Publication number: 20220297113Abstract: A method of manufacturing a digital dispense apparatus includes molding a monolithic carrier structure, forming cut outs into a planar top surface of the monolithic carrier structure, the cut outs including a reservoir extending into part of a thickness of the monolithic carrier structure and fluid routing to connect the reservoir with a fluid dispense device, and overmolding the fluid dispense device into the monolithic carrier structure on a side of the monolithic carrier structure that is opposite to the reservoir to fluidically connect to the fluid routing.Type: ApplicationFiled: June 9, 2022Publication date: September 22, 2022Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Jeffrey A. NIELSEN, Michael W. CUMBIE, Devin Alexander MOUREY, Silam J. CHOY, Kenneth WARD, Christie DUDENHOEFER
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Patent number: 11383230Abstract: A digital dispense apparatus includes at least one fluid dispense device, at least one reservoir fluidically connected to the at least one fluid dispense device, a monolithic carrier structure carrying the at least one fluid dispense device and reservoir, the monolithic carrier forming fluid routing between the reservoir and the fluid dispense device.Type: GrantFiled: March 31, 2016Date of Patent: July 12, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jeffrey A. Nielsen, Michael W. Cumbie, Devin Alexander Mourey, Silam J. Choy, Kenneth Ward, Christie Dudenhoefer
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Patent number: 11364492Abstract: A digital dispense apparatus comprising a plurality of fluid dispense devices, at least one reservoir connected to the plurality of fluid dispense devices to deliver fluid to the plurality of fluid dispense devices, at least one contact pad array, and a single monolithic carrier structure.Type: GrantFiled: March 31, 2016Date of Patent: June 21, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jeffrey A. Nielsen, Michael W. Cumbie, Devin Alexander Mourey, Silam J. Choy, Christie Dudenhoefer, Kenneth Ward
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Publication number: 20220080414Abstract: In one example in accordance with the present disclosure, a fluid analysis device is described. The device includes a substrate, a die adhered to the substrate, and at least one fluid analysis element disposed on the die. A lid is adhered to the substrate and includes a channel formed thereinto be seated over the die. The device also includes an inlet port to the channel and an outlet from the channel. The inlet port and the outlet port are formed on at least one of the substrate and the lid. A number of electrical traces couple the die to a controller.Type: ApplicationFiled: May 7, 2019Publication date: March 17, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Silam J. Choy, Alexander Govyadinov, Erik D. Torniainen, Tod Woodford
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Publication number: 20220072540Abstract: A microfluidic device includes a semiconductor microchip including fluid active circuitry and transistor circuitry, wherein the transistor circuitry provides onboard logic at the semiconductor microchip to control the fluid active circuitry. The microfluidic device further includes a microfluidic chamber fluidly coupled to an inlet port and an outlet port, wherein the microfluidic chamber is defined in part by a microchip surface with the active circuitry positioned to interact with fluid introduced into the microfluidic chamber and partially defined by an enclosing surface. The microchip surface, the enclosing surface, or both include a chemically-modified microfluidic chamber surface that is selectively interactive with a target component of the fluid.Type: ApplicationFiled: May 15, 2019Publication date: March 10, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Silam J. Choy, Hilary Ely
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Patent number: 11130339Abstract: In one example, a fluid flow structure includes a micro device embedded in a monolithic molding having a channel therein through which fluid may flow directly to the device.Type: GrantFiled: July 7, 2017Date of Patent: September 28, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Michael W. Cumbie, Silam J. Choy
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Publication number: 20210229094Abstract: A microfluidic device includes a microfluidic chamber fluidly coupled to an inlet port and an outlet port, a semiconductor microchip including fluid active circuitry and transistor circuitry, and a bed of solid supports positioned within the microfluidic chamber fluidly positioned between the inlet port and the outlet port. The transistor circuitry in this example provides onboard logic at the semiconductor microchip to control fluid active circuitry. The semiconductor microchip also defines a portion of the microfluidic chamber.Type: ApplicationFiled: May 15, 2019Publication date: July 29, 2021Applicant: Hewlett-Packard Development Company, L.P.Inventors: Silam J. CHOY, Hilary ELY
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Publication number: 20210138458Abstract: An example method includes providing fluid to a chamber. The chamber feeds a first channel terminating at a first droplet ejector and a second channel terminating at a second droplet ejector. The method further includes sequencing ejection of droplets at the first droplet ejector and the second droplet ejector to induce negative pressure to provide a sequenced output flow of the fluid through the first channel to a first target microfluidic network and through the second channel to a second target microfluidic network, and controlling the first and second target microfluidic networks to perform an analytical process with the fluid.Type: ApplicationFiled: November 22, 2018Publication date: May 13, 2021Inventors: John LAHMANN, Pavel KORNILOVICH, Silam J CHOY
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Publication number: 20210031188Abstract: An example device includes a chamber to receive a fluid, a first channel in communication with the chamber, a second channel in communication with the chamber, a target microfluidic network at the second channel, a first droplet ejector positioned at the first channel to draw a first portion of fluid through the first channel, and a second droplet ejector positioned at the second channel downstream of the target microfluidic network. The second droplet ejector is to draw a second portion of fluid through the second channel and into the target microfluidic network.Type: ApplicationFiled: November 22, 2018Publication date: February 4, 2021Inventors: John LAHMANN, Pavel KORNILOVICH, Silam J CHOY
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Publication number: 20210023555Abstract: An example device includes a chamber including a fluid inlet, a fluid outlet, and a negative-pressure port. The negative-pressure port is positioned relative to the fluid inlet to draw a droplet of a fluid from the fluid inlet into the chamber when the fluid is applied to the fluid inlet and negative pressure is applied to the negative-pressure port. The fluid outlet is positioned relative to the fluid inlet to collect the droplet. The example device further includes a downstream microfluidic channel connected to the fluid outlet of the chamber. The downstream microfluidic channel communicates capillary action to the fluid outlet of the chamber. The capillary action resists flow of the fluid from the fluid outlet into the chamber induced by the negative pressure applied to the negative-pressure port.Type: ApplicationFiled: November 21, 2018Publication date: January 28, 2021Inventors: John LAHMANN, Silam J CHOY, Pavel KORNILOVICH
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Publication number: 20200369031Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.Type: ApplicationFiled: August 12, 2020Publication date: November 26, 2020Inventors: Silam J. Choy, Michael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
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Patent number: 10836169Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.Type: GrantFiled: July 2, 2018Date of Patent: November 17, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Silam J. Choy, Michael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
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Patent number: 10603922Abstract: In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.Type: GrantFiled: January 22, 2015Date of Patent: March 31, 2020Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: David R Otis, Silam J Choy, Kevin E Swier, Zhuqing Zhang
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Patent number: 10603911Abstract: A printhead includes a moldable substrate, and a number of printhead dies molded into the moldable substrate. The printhead dies include a number of printhead dies molded into the moldable substrate. The dies comprise a non-rectangular shape. A number of fluid slots are defined in the moldable substrate to fluidically coupled to the printhead dies to feed fluid to the printhead dies. The number of fluid slots is not equal to the number of printhead dies.Type: GrantFiled: October 12, 2015Date of Patent: March 31, 2020Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Chien-Hua Chen, Michael W. Cumbie, Silam J. Choy
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Patent number: 10589530Abstract: In one example in accordance with the present disclosure a printer cartridge is described. The printer cartridge includes multiple backpressure chambers in fluid communication with a shared free fluid chamber. The backpressure chambers are to supply a fluid to nozzles of a portion of a fluidic ejection assembly and to provide backpressure to the nozzles of the fluidic ejection assembly during deposition of fluid onto a print medium.Type: GrantFiled: October 28, 2015Date of Patent: March 17, 2020Assignee: Hewlett-Packard Development Company, L.P.Inventors: Silam J. Choy, Steven T. Castle, Arun K. Agarwal, Blair Kent
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Patent number: 10500858Abstract: In an example, a fluid ejection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity.Type: GrantFiled: March 12, 2018Date of Patent: December 10, 2019Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Gary G. Lutnesky, Silam J. Choy
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Patent number: 10479081Abstract: In one example in accordance with the present disclosure a flexible printhead is described. The printhead includes a number of printhead die, a printhead die including a number of nozzles to deposit an amount of fluid onto a print medium. The printhead also includes a fluid delivery system to deliver the amount of fluid from a fluid supply to the number of nozzles. The printhead also includes a number of electrical circuits to electronically couple the number of printhead die with a printing device. The printhead also includes a flexible substrate on which the number of printhead die and the number of electrical circuits are mounted.Type: GrantFiled: October 12, 2015Date of Patent: November 19, 2019Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventor: Silam J. Choy