Abstract: The present invention relates to the field of semiconductor chip packages, and more specifically to a lead frame and flip chip package device thereof. In one embodiment, a lead frame for electrically connecting a chip to outside leads, can include a plurality of lead fingers, where each of the plurality of lead fingers comprises a plurality of outburst regions extending from an edge thereof. In one embodiment, a flip chip package device can include: a chip and a plurality of solder bumps, where one surface of the chip is connected to a first surface of each of the plurality of solder bumps; and the lead frame, where second surfaces of each of the plurality solder bumps are connected with corresponding outburst regions of the lead frame to connect the chip to the lead frame through the solder bumps.

Abstract: Methods and circuits related to power regulation are disclosed. In one embodiment, a power regulator for converting an input electrical signal to an output electrical signal to supply power to a load, can include: (i) a power stage having switching devices and a filter; (ii) a regulation signal generator for the switching devices that includes a feedback circuit and a PWM, the feedback circuit receiving an output signal from the power stage, the PWM receiving an output from the feedback circuit, and generating a PWM control signal; (iii) a constant time generator receiving the PWM control signal and generating a constant time signal based on the PWM control signal duty cycle; and (iv) a logic/driving circuit receiving the PWM control signal and the constant time signal, and controlling operation of the switching devices to modulate the output signal from the power stage, and maintaining a pseudo constant operation frequency.