Patents by Inventor Sili Wang

Sili Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260252757
    Abstract: Provided is a dynamic-static unified loading path design method for a true triaxial mechanical test. Loading path design is carried out in a stress space, and a principal stress space is cut into a series of stress meridian plane spaces, thereby transforming a three-dimensional design environment into a two-dimensional design environment; and a design result in the two-dimensional design environment is converted back into a final three-dimensional design result. Distribution of dynamic-static true triaxial mechanical test loading paths within the stress space is designed according to requirements.
    Type: Application
    Filed: April 9, 2026
    Publication date: August 27, 2026
    Inventors: JIANBO ZHU, ZHUO CEN, HEPING XIE, TAO ZHOU, WEIYUE BAO, SHIWEI ZHANG, CHENGCHENG XIE, JUNYAN LI, LINSHENG LIANG, SILI WANG, QI HE, KANGYU WANG, KONGWEI ZHANG
  • Patent number: 11578384
    Abstract: The invention provides a laser shock processing method for small-hole component with different thickness. In this method, different process parameters are adopted for laser shock processing of small hole members with different thicknesses, and the empirical formula was obtained by statistical analysis of the experimental results, and the empirical formula I 0 = A ? e t B ? ? s 2 Z is the relationship between power density and thickness of small hole members. According to this formula, the power density of laser shock strengthening of orifice member with different thickness is determined, and the selection and determination method of process parameters related to this is put forward. According to this method, reasonable residual compressive stress distribution can be obtained after laser shock strengthening with appropriate technology, and good strengthening effect can be achieved.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: February 14, 2023
    Assignee: JIANGSU UNIVERSITY
    Inventors: Yinfang Jiang, Fuwen Zhu, Wenfan Jiang, Sili Wang, Jian Zhao, Wei Jin, Cheng Hua, Xu Li
  • Publication number: 20210363605
    Abstract: A laser shock strengthening method for small-hole components (4) with different thicknesses. In the method, different technological parameters are used for laser shock strengthening of the small-hole components (4) with different thicknesses, statistical analysis is conducted after a large number of tests to obtain an empirical formula; the empirical formula is a relational expression AA of the power density and the thicknesses of the small-hole component (4). The power density of laser shock strengthening of the small-hole components (4) with different thicknesses can be determined according to the relational expression; and a method for selecting and determining related technological parameters is provided.
    Type: Application
    Filed: June 8, 2017
    Publication date: November 25, 2021
    Inventors: Yinfang Jiang, Fuwen Zhu, Wenfan Jiang, Sili Wang, Jian Zhao, Wei Jin, Cheng Hua, Xu Li