Patents by Inventor Silicon Microstructures, Inc.

Silicon Microstructures, Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130341740
    Abstract: Pressure sensors having components with reduced variations due to stresses caused by various layers and components that are included in the manufacturing process. In one example, a first stress in a first direction causes a variation in a component. A second stress in a second direction is applied, thereby reducing the variation in the component. The first and second stresses may be caused by a polysilicon layer, while the component may be a resistor in a Wheatstone bridge.
    Type: Application
    Filed: March 26, 2013
    Publication date: December 26, 2013
    Applicant: Silicon Microstructures, Inc.
    Inventor: Silicon Microstructures, Inc.