Patents by Inventor Silke Czaja

Silke Czaja has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component that can be soldered in SMD technology and method for producing a component that can be soldered in SMD technology
    Patent number: 11901149
    Abstract: An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: February 13, 2024
    Assignee: Endress+Hauser SE+Co. KG
    Inventors: Bernd Strütt, Dietmar Birgel, Silke Czaja
  • COMPONENT THAT CAN BE SOLDERED IN SMD TECHNOLOGY AND METHOD FOR PRODUCING A COMPONENT THAT CAN BE SOLDERED IN SMD TECHNOLOGY
    Publication number: 20220301802
    Abstract: An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.
    Type: Application
    Filed: August 3, 2020
    Publication date: September 22, 2022
    Inventors: Bernd Strütt, Dietmar Birgel, Silke Czaja