Patents by Inventor Silke Settegast

Silke Settegast has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11073022
    Abstract: A turbine blade has a blade tip, a cooling structure with cooling channels which are designed to have cooling fluid passed through them in order to cool the turbine blade during operation, an end section at a lower level than that of the blade tip, and an outer wall section extending up to the blade tip. The cooling structure is formed between the end section and the blade tip. A method produces a cooling structure of this type.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: July 27, 2021
    Assignee: Siemens Energy Global GmbH & Co. KG
    Inventors: Reiner Anton, Georg Bostanjoglo, Arturo Flores Renteria, Jacek Grodzki, Robert Herfurth, Eckart Schumann, Silke Settegast, Rüstü Söl
  • Publication number: 20200291788
    Abstract: A turbine blade has a blade tip, a cooling structure with cooling channels which are designed to have cooling fluid passed through them in order to cool the turbine blade during operation, an end section at a lower level than that of the blade tip, and an outer wall section extending up to the blade tip. The cooling structure is formed between the end section and the blade tip. A method produces a cooling structure of this type.
    Type: Application
    Filed: March 22, 2017
    Publication date: September 17, 2020
    Applicant: Siemens Aktiengesellschaft
    Inventors: Reiner Anton, Georg Bostanjoglo, Arturo Flores Renteria, Jacek Grodzki, Robert Herfurth, Eckart Schumann, Silke Settegast, Rüstü Söl
  • Publication number: 20170225270
    Abstract: A method for producing through-holes in a wall of a component, by laser radiation is provided, that includes a wall delimiting a cavity in which a protection agent is provided that can be liquefied when heated. According to the method, through-holes are successively produced in the wall of the component in a plurality of defined points, two directly subsequent through-holes being produced such that a through-hole is produced in a predetermined point and the next through-hole is produced in an additional point which is further away from the predetermined point than at least two, in particular three or more omitted points that are closer to the predetermined point, and/or are produced such that a through-hole is produced in a predetermined point and the next through-hole is produced an additional point.
    Type: Application
    Filed: October 1, 2015
    Publication date: August 10, 2017
    Inventors: THOMAS BECK, GEORG BOSTANJOGLO, JENS DIETRICH, OLIVER KATZURKE, MARCEL KRÜGERKE, JAN MÜNZER, SILKE SETTEGAST
  • Publication number: 20160031049
    Abstract: By previous inclusion of a through-hole in a substrate before coating and subsequent removal, the processing times for producing a through-hole with a diffuser are shortened and thereby the intermediate layers are less stressed.
    Type: Application
    Filed: February 4, 2014
    Publication date: February 4, 2016
    Inventors: Christian MENKE, Silke SETTEGAST, Volker VOSBERG
  • Patent number: 8704128
    Abstract: There are a multiplicity of methods of making through-holes. In particular in the production of a multiplicity of film-cooling holes, as in gas turbine blades or combustion chamber elements, small time advantages are also important when making a hole. The method according to the invention, to make the hole close to the final contour in each case in sections in a top and a bottom region in order to then produce the final contour with other laser parameters, achieves time advantages.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: April 22, 2014
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Beck, Nigel-Philip Cox, Silke Settegast
  • Publication number: 20140048521
    Abstract: There are a multiplicity of methods of making through-holes. In particular in the production of a multiplicity of film-cooling holes, as in gas turbine blades or combustion chamber elements, small time advantages are also important when making a hole. The method according to the invention, to make the hole close to the final contour in each case in sections in a top and a bottom region in order to then produce the final contour with other laser parameters, achieves time advantages.
    Type: Application
    Filed: October 24, 2013
    Publication date: February 20, 2014
    Inventors: Thomas Beck, Nigel-Philip Cox, Silke Settegast
  • Patent number: 8618439
    Abstract: There are a multiplicity of methods of making through-holes. In particular in the production of a multiplicity of film-cooling holes, as in gas turbine blades or combustion chamber elements, small time advantages are also important when making a hole. The method according to the invention, to make the hole close to the final contour in each case in sections in a top and a bottom region in order to then produce the final contour with other laser parameters, achieves time advantages.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: December 31, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Beck, Nigel-Philip Cox, Silke Settegast
  • Patent number: 8292584
    Abstract: Conventionally coated components with film cooling holes are known, comprising a diffuser, extending through the layers into the substrate. According to the invention, the component is embodied such that the whole diffuser is largely arranged in the layer.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: October 23, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Beck, Silke Settegast
  • Patent number: 8269132
    Abstract: The invention relates to a method for electrical discharge machining of electrically non-conductive material in which a layer of an electrically conductive substance is applied as an auxiliary electrode on the electrically non-conductive material. Said method is characterized in that the electrically conductive substance is chemically converted by oxidative heat treatment after electrical discharge machining.
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: September 18, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ralf Förster, Karsten Klein, Ulrich Laudien, Silke Settegast, Ramesh Subramanian
  • Patent number: 8237082
    Abstract: There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.
    Type: Grant
    Filed: January 5, 2007
    Date of Patent: August 7, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Beck, Silke Settegast
  • Publication number: 20120145678
    Abstract: There are a multiplicity of methods of making through-holes. In particular in the production of a multiplicity of film-cooling holes, as in gas turbine blades or combustion chamber elements, small time advantages are also important when making a hole. The method according to the invention, to make the hole close to the final contour in each case in sections in a top and a bottom region in order to then produce the final contour with other laser parameters, achieves time advantages.
    Type: Application
    Filed: February 15, 2012
    Publication date: June 14, 2012
    Inventors: Thomas Beck, Nigel-Philip Cox, Silke Settegast
  • Publication number: 20120091106
    Abstract: There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.
    Type: Application
    Filed: January 5, 2007
    Publication date: April 19, 2012
    Inventors: Thomas Beck, Silke Settegast
  • Patent number: 8157526
    Abstract: Conventionally coated components with film cooling holes are known, comprising a diffuser, extending through the layers into the substrate. According to the invention, the component is embodied such that the whole diffuser is largely arranged in the layer.
    Type: Grant
    Filed: March 16, 2006
    Date of Patent: April 17, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Beck, Silke Settegast
  • Patent number: 8153923
    Abstract: There are a multiplicity of methods of making through-holes. In particular in the production of a multiplicity of film-cooling holes, as in gas turbine blades or combustion chamber elements, small time advantages are also important when making a hole. The method according to the invention, to make the hole close to the final contour in each case in sections in a top and a bottom region in order to then produce the final contour with other laser parameters, achieves time advantages.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: April 10, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Beck, Nigel-Philip Cox, Silke Settegast
  • Patent number: 8123110
    Abstract: A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at a temperature plateau with a temperature that is lower than a temperature of the previous plateau.
    Type: Grant
    Filed: October 4, 2010
    Date of Patent: February 28, 2012
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ingo Berger, Jan Münzer, Ingo Reinkensmeier, Silke Settegast
  • Publication number: 20110300000
    Abstract: Conventionally coated components with film cooling holes are known, comprising a diffuser, extending through the layers into the substrate. According to the invention, the component is embodied such that the whole diffuser is largely arranged in the layer.
    Type: Application
    Filed: August 22, 2011
    Publication date: December 8, 2011
    Inventors: Thomas Beck, Silke Settegast
  • Publication number: 20110017809
    Abstract: A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at a temperature plateau with a temperature that is lower than a temperature of the previous plateau.
    Type: Application
    Filed: October 4, 2010
    Publication date: January 27, 2011
    Inventors: Ingo Berger, Jan Münzer, Ingo Reinkensmeier, Silke Settegast
  • Patent number: 7832620
    Abstract: In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the temperature is lowered successively during the soldering operation.
    Type: Grant
    Filed: June 17, 2009
    Date of Patent: November 16, 2010
    Assignee: Siemens Aktiengesellschaft
    Inventors: Ingo Berger, Jan Münzer, Ingo Reinkensmeier, Silke Settegast
  • Publication number: 20100147812
    Abstract: There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.
    Type: Application
    Filed: January 5, 2007
    Publication date: June 17, 2010
    Inventors: Thomas Beck, Silke Settegast
  • Patent number: 7669326
    Abstract: It is known from the prior art that holes in a workpiece are filled completely with a solder powder, which leads especially in the case of large holes to the formation of cracks within the solder due to the large volume filled in once the solder cools off after soldering. The invention provides a method for closing a recess of a workpiece, which allows closing an opening of a recess without the risk of crack formation, by using only a solder film for closing the recess. The solder film has a content of non-melting material and therefore is substantially less prone to form cracks.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: March 2, 2010
    Assignee: Siemens Aktiengesellschaft
    Inventors: Andre Jeutter, Silke Settegast