Abstract: For the method for manufacturing electrically conducting structures one produces or prepares an electrically insulating layer so that it has a surface with recesses at the locations at which the electrically conducting structures are to arise. At least some of the recesses, perpendicular to a surface of the substrate, have a cross section in which the aspect ratio (the ratio between depth (t) and width (b) of the structures) is between 1:5 and 5:1, for example at least 2:3. The substrate surface is provided with an electrically conducting layer which is thin in comparison to the characteristic dimensions of the recesses. Subsequently the surface of the substrate is galvanised for so long until the recesses are filled.

Abstract: The method for producing an electrical connecting element is essentially characterized in that a plastic deformable substrate is formed with an embossing tool in an embossing step in such a way that recesses are made in said substrate in the areas in which conductive strips and, for instance, through holes or contact surfaces should be formed. The substrate is then coated with a thin conductive layer. In a following step, conductive material is galvanically deposited on the substrate until the recesses are filled with conductive material. Subsequently, the conductive material is removed the corresponding areas of the substrate that should not have any conductive surface are free from any metal coating.