Patents by Inventor Silqun Leung

Silqun Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip package with undermount passive devices
    Patent number: 9607935
    Abstract: Various semiconductor chip packages with undermounted passive devices and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a first side of a carrier substrate where the carrier substrate includes a second side opposite the first side. At least one passive device is coupled to the second side of the carrier substrate. The at least one passive device includes at least one first terminal electrically coupled to the semiconductor chip and at least one second terminal adapted to couple to a printed circuit board.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: March 28, 2017
    Assignee: ATI Technologies ULC
    Inventors: Liane Martinez, Neil McLellan, Silqun Leung, Gabriel Wong
  • Semiconductor chip substrate with multi-capacitor footprint
    Patent number: 8012874
    Abstract: Various methods and apparatus for coupling capacitors to a chip substrate are disclosed. In one aspect, a method of manufacturing is provided that includes forming a mask on a semiconductor chip substrate that has plural conductor pads. The mask has plural openings that expose selected portions of the plural conductor pads. Each of the plural openings has a footprint corresponding to a footprint of a smallest size terminal of a capacitor adapted to be coupled to the semiconductor chip substrate. A conductor material is placed in the plural openings to establish plural capacitor pads.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: September 6, 2011
    Assignee: ATI Technologies ULC
    Inventors: Yue Li, Silqun Leung, Terence Cheung, Sally Yeung, Liane Martinez
  • Semiconductor Chip Package with Undermount Passive Devices
    Publication number: 20100265682
    Abstract: Various semiconductor chip packages with undermounted passive devices and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a first side of a carrier substrate where the carrier substrate includes a second side opposite the first side. At least one passive device is coupled to the second side of the carrier substrate. The at least one passive device includes at least one first terminal electrically coupled to the semiconductor chip and at least one second terminal adapted to couple to a printed circuit board.
    Type: Application
    Filed: April 21, 2009
    Publication date: October 21, 2010
    Inventors: Liane Martinez, Neil McLellan, Silqun Leung, Gabriel Wong
  • Semiconductor Chip Substrate with Multi-Capacitor Footprint
    Publication number: 20090152690
    Abstract: Various methods and apparatus for coupling capacitors to a chip substrate are disclosed. In one aspect, a method of manufacturing is provided that includes forming a mask on a semiconductor chip substrate that has plural conductor pads. The mask has plural openings that expose selected portions of the plural conductor pads. Each of the plural openings has a footprint corresponding to a footprint of a smallest size terminal of a capacitor adapted to be coupled to the semiconductor chip substrate. A conductor material is placed in the plural openings to establish plural capacitor pads.
    Type: Application
    Filed: December 14, 2007
    Publication date: June 18, 2009
    Inventors: Yue Li, Silqun Leung, Terence Cheung, Sally Yeung, Liane Martinez